APTM100DSK35T3G

$86.84

Description：MOSFET 2N-CH 1000V 22A SP3
Series：-

SKU:595d3c90a099 Category: FET, MOSFET Arrays Brand: Microchip Technology

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

Product Detailed Parameters

Description：MOSFET 2N-CH 1000V 22A SP3
Series：-
Mfr：Microchip Technology
Package：Bulk
Technology：MOSFET (Metal Oxide)
Configuration：2 N-Channel (Dual)
FET Feature：-
Drain to Source Voltage (Vdss)：1000V (1kV)
Current - Continuous Drain (Id) @ 25°C：22A
Rds On (Max) @ Id, Vgs：420mOhm @ 11A, 10V
Vgs(th) (Max) @ Id：5V @ 2.5mA
Gate Charge (Qg) (Max) @ Vgs：186nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds：5200pF @ 25V
Power - Max：390W
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP3
Supplier Device Package：SP3
Grade：-
Qualification：-

Download product information

APTM100DSK35T3G

Overview

The APTM100DSK35T3G is a PM-MOSFET-7-SP3 module featuring dual buck chopper topology with an integrated NTC thermistor. It utilizes Silicon technology and offers a drain-source voltage of 1000V. The typical on-state resistance is 350mΩ, supporting a continuous current of 17A at 80°C case temperature. The pulsed drain current reaches 88A, with a power dissipation rating of 390W. The gate-source voltage withstands ±30V. The component is housed in the SP3 package.

Feature Summary

Dual buck chopper configuration for efficient switching applications
Integrated NTC thermistor for precise thermal monitoring
High voltage capability suitable for robust power systems

Applications

Industrial motor drives
Power supply inverters
DC-DC converter stages

Procurement Notes

Verify the specific suffix T3G against official Microchip documentation to confirm tape-and-reel packaging and exact revision status. Cross-reference the datasheet for any recent product change notifications or pinout updates. Ensure the SP3 package dimensions match the target PCB footprint requirements before finalizing procurement orders.

Selection Notes

Select this module when high voltage isolation and integrated thermal sensing are required. The dual buck topology simplifies circuit design for synchronous rectification. Consider the 350mΩ Rds(on) for conduction loss calculations. Verify that the 17A continuous current rating aligns with the thermal management strategy of the host system.

Part Context

This component belongs to the Microchip Power MOSFET 7 series, designed for high-performance power conversion. The SP3 package provides a compact form factor compared to larger discrete assemblies. It integrates multiple switches and protection elements into a single reliable unit, reducing board space and interconnection complexity.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Consult Microchip Technology directly for qualified alternatives or cross-reference options based on identical electrical specifications and package compatibility.