APTM50AM38FTG

Overview

The APTM50AM38FTG is a dual N-channel POWER MOS 7® MOSFET array manufactured by Microchip Technology. It features a 500V drain-source voltage rating and a continuous drain current of 90A per channel. The module delivers a total power dissipation of 694W and utilizes the SP-4 chassis mount package. This silicon-based discrete semiconductor component is designed for high-power switching applications requiring robust thermal performance and low on-resistance characteristics.

Feature Summary

• Integrates two independent N-channel MOSFETs within a single chassis-mount package for space-efficient designs.
• Utilizes POWER MOS 7 technology to achieve optimized trade-offs between conduction losses and switching speed.
• Provides high thermal conductivity through direct chassis mounting, facilitating efficient heat dissipation in industrial environments.

Applications

• High-power motor drive inverters
• Industrial welding equipment
• Uninterruptible power supply (UPS) systems

Procurement Notes

Verify the specific suffix FTG against the official Microchip datasheet to confirm package variant and tape/reel or tube packaging configuration. Ensure the ordering part number matches the required pinout and thermal interface specifications for your chassis design. Cross-reference with the latest product change notifications to confirm material composition and RoHS compliance status prior to procurement.

Selection Notes

Select this component when designing circuits requiring dual isolated N-channel switches with a 500V blocking capability. The 90A current rating suits moderate-to-high power density applications. Consider the SP-4 package dimensions for mechanical integration. Evaluate the 694W power dissipation limit against your thermal management strategy to ensure junction temperatures remain within safe operating limits during peak load conditions.

Part Context

This device belongs to the APTM series of discrete power modules from Microchip Technology. It represents an evolution in silicon MOSFET packaging, combining multiple dies into a single hermetically sealed unit. The series targets industrial and automotive sectors where reliability and thermal efficiency are critical. It complements single-die modules by offering integrated switching solutions for bridge configurations.

Replacement Considerations

Consult Microchip's official cross-reference documentation for verified substitutes. Direct replacements must match the 500V/90A/SP-4 specification profile. Verify pin compatibility and thermal resistance values before substituting with other manufacturers' dual MOSFET arrays.