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Product Detailed Parameters
- Description：MOSFET 2N-CH 500V 90A SP4
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Half Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：500V
- Current - Continuous Drain (Id) @ 25°C：90A
- Rds On (Max) @ Id, Vgs：45mOhm @ 45A, 10V
- Vgs(th) (Max) @ Id：5V @ 5mA
- Gate Charge (Qg) (Max) @ Vgs：246nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：11200pF @ 25V
- Power - Max：694W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP4
- Supplier Device Package：SP4
- Grade：-
- Qualification：-
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Overview
The APTM50AM38STG is a discrete semiconductor module manufactured by Microchip Technology, utilizing silicon technology. It belongs to the MOSFET-SBD Modules product category and is identified as a PM-MOSFET-7-SBD-SP4 configuration. The component is supplied in tube packaging with a factory pack quantity of one unit per package. This module integrates power MOSFETs and Schottky barrier diodes within a single assembly designed for high-power switching applications.
Feature Summary
- Integrates power MOSFETs and Schottky barrier diodes into a single discrete semiconductor module
- Utilizes silicon-based technology for power switching operations
- Designed for screw-mount installation via the SP4 package format
Applications
- High-power DC-DC converter circuits
- Motor drive inverter stages
- Industrial power supply systems
Procurement Notes
Verify the exact part number spelling against official Microchip documentation, as the suffix STG may indicate specific tape-and-reel or tube variations not explicitly detailed in general distributor listings. Confirm RoHS compliance status through the manufacturer's datasheet before procurement. Ensure the ordering suffix matches the required packaging type for your assembly line. Cross-reference the Mouser catalog number 494-APTM50AM38STG with the manufacturer's official part identifier to avoid substitution errors during purchasing.
Selection Notes
Select this module when a combined MOSFET and Schottky diode solution is required in a compact SP4 footprint. Consider the silicon technology limitations regarding switching frequency compared to wide-bandgap alternatives. Evaluate the thermal management requirements associated with the SOT-227 style mounting interface. Verify that the voltage and current ratings meet the specific circuit demands of the target application design.
Part Context
This component is part of Microchip's broader portfolio of discrete power modules, specifically within the APTM series which combines active switching devices with freewheeling diodes. The SP4 package designation indicates a standardized mechanical form factor used across various voltage and current ratings in this family. These modules are engineered to reduce parasitic inductance and improve thermal performance compared to discrete component assemblies.
