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Product Detailed Parameters
- Description：MOSFET 6N-CH 500V 51A SP6-P
- Series：-
- Mfr：Microsemi Corporation
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：6 N-Channel (3-Phase Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：500V
- Current - Continuous Drain (Id) @ 25°C：51A
- Rds On (Max) @ Id, Vgs：78mOhm @ 25.5A, 10V
- Vgs(th) (Max) @ Id：5V @ 2.5mA
- Gate Charge (Qg) (Max) @ Vgs：140nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：7000pF @ 25V
- Power - Max：390W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6-P
- Grade：-
- Qualification：-
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Overview
The APTM50TDUM65PG is a power module manufactured by Microchip Technology, formerly Microsemi. It utilizes Silicon (Si) technology and features an SP6-P package designed for screw mount installation. The device is classified as a MOSFET module within the discrete and power modules sub-category. It operates within a temperature range of -40°C to +100°C.
Feature Summary
- Integrated MOSFET configuration suitable for high-power switching applications
- SP6-P package design facilitating robust mechanical mounting via screw terminals
- Silicon-based construction ensuring reliable thermal performance
Applications
- Industrial motor drives
- Power supply systems
- Inverter circuits
Procurement Notes
Verify the manufacturer designation carefully, as the component is currently listed under Microchip Technology following corporate acquisitions. Confirm the specific suffix PG corresponds to the required tube packaging format. Ensure compatibility with existing SP6-P footprint requirements in the target assembly design before finalizing procurement orders.
Selection Notes
Select this component when a triple dual common source MOSFET configuration is required in an SP6-P housing. Evaluate the thermal management capabilities against the specified operating temperature limits. Consider the screw mount style for mechanical stability in high-vibration environments compared to surface mount alternatives.
Part Context
This module belongs to the broader family of power semiconductor devices produced by Microchip Technology. It serves as a critical switching element in power electronics, bridging the gap between control signals and high-current loads. The SP6-P form factor is standard for medium-power industrial applications requiring durable packaging.
Replacement Considerations
Consult official Microchip documentation for direct cross-reference part numbers. Verify pinout compatibility and electrical specifications before substituting with other SP6-P MOSFET modules from different manufacturers.
