RF Diode BAP63-02,115 product image

BAP63-02,115

$0.28
  • Description:RF DIODE PIN 50V 715MW SOD-523
  • Series:-

SKU:74e006d79324 Category: Brand:

  
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BAP63-02,115 is listed in the RF Diode range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is RF DIODE PIN 50V 715MW SOD-523. Review the specifications below when checking this part for your BOM.

RF Diode specifications for BAP63-02,115

  • Description:RF DIODE PIN 50V 715MW SOD-523
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Diode Type:PIN - Single
  • Voltage - Peak Reverse (Max):50V
  • Current - Max:100 mA
  • Capacitance @ Vr, F:0.32pF @ 20V, 1MHz
  • Resistance @ If, F:1.5Ohm @ 100mA, 100MHz
  • Power Dissipation (Max):715 mW
  • Operating Temperature:-65°C ~ 150°C (TJ)
  • Package / Case:SC-79, SOD-523
  • Supplier Device Package:SOD-523
  • Grade:-
  • Qualification:-

RF Diode datasheet and documents for BAP63-02,115

BAP63-02,115

RF Diode Overview

The BAP63-02 is a silicon PIN diode manufactured by NXP Semiconductors, housed in an SOD523 ultra-small surface-mount plastic package. Designed for high-speed RF signal switching up to 3 GHz, it features low capacitance and forward resistance with minimal series inductance. Key electrical parameters include a continuous reverse voltage of 50 V and a continuous forward current of 100 mA. At 25 °C, the forward voltage is typically 0.95 V at 50 mA, while diode capacitance ranges from 0.25 pF to 0.36 pF depending on reverse bias. The device exhibits low insertion loss (e.g., 0.09 dB at 900 MHz with 100 mA bias) and significant isolation (15.6 dB at 900 MHz). Thermal resistance from junction to soldering point is specified at 85 K/W.

RF Diode Feature Summary

  • High-speed switching capability for RF signals
  • Ultra-small SOD523 surface-mount package
  • Low diode capacitance and forward resistance
  • Very low series inductance

RF Diode Applications

  • RF attenuators
  • RF switches

RF Diode Procurement Notes

Verify the specific ordering suffix against official NXP documentation to confirm tape-and-reel packaging details and marking codes. Ensure the component status matches current production requirements, as datasheet revisions may indicate obsolescence or specification updates. Cross-reference the manufacturer's latest product selector guide to confirm availability and compliance with regional regulatory standards before finalizing procurement orders.

RF Diode Selection Notes

Select this component for designs requiring compact RF switching solutions operating up to 3 GHz. Evaluate thermal constraints carefully, as the small SOD523 package limits power dissipation to 715 mW. Compare capacitance values under expected reverse bias voltages to ensure adequate isolation performance. Verify that the required forward current levels align with the low forward resistance characteristics to minimize insertion loss in the signal path.

RF Diode Part Context

This part belongs to the BAP63 family of silicon PIN diodes from NXP Semiconductors, originally developed under Philips Semiconductors. It shares functional similarities with other variants like the BAP63-05 but differs in pin configuration and specific electrical characteristics. The SOD523 package distinguishes it from larger packages used in higher-power diode applications within the same product line.

RF Diode Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult NXP's official replacement guides or distributor cross-reference tools for verified alternatives.

BAP63-02,115BAP63-02,115
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