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The BAV74LT1 is a monolithic dual switching diode from onsemi, housed in an SOT-23 (TO-236AB) surface-mount package. It contains two independent diodes sharing a common cathode. Each diode supports a maximum reverse voltage of 50 Vdc and a forward current of 200 mAdc. Key electrical characteristics include a reverse recovery time of 4.0 ns, a maximum diode capacitance of 2.0 pF at 0 V bias, and a forward voltage drop of 1.0 Vdc at 100 mA. The device operates within a junction temperature range of -55°C to +150°C.
Verify the component marking code 'JA' on the physical device to confirm it matches the BAV74LT1 specification. Ensure the package style corresponds to Case 318-08 (SOT-23). Confirm that the application environment remains within the specified operating temperature range of -55°C to +150°C to maintain reliability. Check datasheet notes regarding individual diode leakage when the companion diode is unbiased.
Select this component when a dual diode solution with a shared cathode is required in a small surface-mount footprint. It is appropriate for designs needing fast switching speeds and low capacitance. Consider the 50 V reverse voltage rating and 200 mA forward current limits during circuit design. Evaluate the thermal dissipation requirements based on the specific PCB copper area available for heat spreading.
This part belongs to the BAV series of dual switching diodes manufactured by onsemi. It utilizes the standard SOT-23 package, designated as Case 318-08. The device integrates two discrete diodes into a single monolithic chip, offering a space-efficient alternative to using separate components in printed circuit board layouts.
Consult official cross-reference lists for verified substitutes. Ensure any replacement maintains the SOT-23 package and shares the common cathode topology. Verify that electrical parameters such as reverse voltage, forward current, and reverse recovery time meet or exceed the original specifications.
Pin 1 is Anode, Pin 2 is Anode, and Pin 3 is the common Cathode.
The maximum reverse breakdown voltage is 50 Vdc.
Preheating is required, and the soldering temperature must not exceed 260°C for more than 10 seconds to prevent damage.