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BC52PA-QX is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is BC52PA-Q/SOT1061/HUSON3. Review the specifications below when checking this part for your BOM.
The BC52PA-QX is a PNP silicon medium power transistor manufactured by Nexperia. It operates with a collector-emitter voltage of 60 V and a maximum continuous collector current of 1 A. The device utilizes an ultra-thin SOT1061 leadless small surface-mounted device plastic package, which includes an exposed heatsink for enhanced thermal conductivity. Key electrical parameters include a minimum DC current gain (hFE) of 40. The component is RoHS compliant and designed for applications requiring high current handling and efficient heat dissipation in compact form factors.
Verify the specific suffix designation against official Nexperia documentation to confirm exact binning or tape-and-reel specifications. Ensure the procurement channel provides valid traceability records. Confirm that the delivered components match the RoHS compliance status indicated in the datasheet. Cross-reference the part number with the manufacturer's latest longevity program information to ensure long-term availability for production planning.
Select this component when a PNP transistor with 60 V breakdown and 1 A current capacity is required in a low-profile surface-mount footprint. The exposed pad feature makes it suitable for designs where thermal management is critical within a small area. Consider the available hFE bins during circuit design to ensure consistent performance across different units. Verify that the operating temperature range aligns with the application's environmental constraints.
This device belongs to Nexperia's family of PNP medium power transistors engineered for surface-mount technology. It is housed in the SOT1061 package, also known as HUSON3, which integrates a metal tab for direct thermal coupling to the PCB copper plane. This packaging strategy allows standard small-outline footprints to handle significantly higher power levels compared to traditional plastic packages without exposed pads.
Direct substitutes may include other PNP transistors from the same series with identical pinouts and electrical ratings. Verify compatibility regarding the specific hFE binning if precise gain control is necessary. Ensure any replacement maintains the same SOT1061 package dimensions and thermal characteristics to fit existing board layouts without modification.
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