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The BC807-25QAZ is a PNP general-purpose transistor manufactured by Nexperia, distributed under the NXP brand. It operates with a collector-emitter voltage of -45 V and a continuous collector current of -500 mA. The device utilizes a DFN1010D-3 (SOT1215) leadless ultra-small SMD plastic package with visible and solderable side pads, featuring a low profile height of 0.37 mm. It offers two current gain selections, with the BC807-25QA variant providing an hFE range of 160 to 400 at IC = -100 mA. The component is AEC-Q101 qualified for automotive applications.
Verify the specific suffix 'QAZ' against the official Nexperia ordering information table, as the datasheet lists 'BC807-25QA'. Confirm that the 'Q' suffix denotes AEC-Q101 qualification and the 'Z' suffix indicates tape-and-reel packaging. Ensure the manufacturer source is identified as Nexperia, consistent with NXP USA Inc. distribution channels.
Select this component when a compact PNP transistor with automotive qualification is required. The DFN1010D-3 package is suitable for space-constrained designs. Choose the BC807-25QA variant if a DC current gain between 160 and 400 is needed. Verify thermal dissipation requirements against the provided derating curves for the specific PCB footprint used.
This part belongs to the BC807 series of PNP general-purpose transistors. It serves as the complement to the BC817 NPN series. The QA suffix variants are specifically designed for automotive environments, adhering to AEC-Q101 standards. The DFN1010D-3 package represents a newer, smaller form factor compared to traditional SOT-23 packages.
Public confirmed substitute part numbers include BC807-40QA for higher gain requirements. For non-automotive applications, standard BC807-25 in SOT-23 packages may be considered if size constraints allow.
The maximum collector-emitter voltage (VCEO) is -45 V.
Yes, the product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101.
It uses a DFN1010D-3 (SOT1215) leadless ultra-small SMD plastic package with visible and solderable side pads.