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The BC849C,235 is an NPN general-purpose transistor manufactured by Nexperia USA Inc. It is housed in a small SOT23 Surface-Mounted Device plastic package with three terminals. The device supports a maximum collector-emitter voltage of 30 V and a continuous collector current of 100 mA. It features a DC current gain (hFE) ranging from 420 to 800 at IC = 2 mA and VCE = 5 V. The component is qualified under the AEC-Q101 standard for automotive applications.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging details and manufacturing site codes. Confirm that the AEC-Q101 qualification status aligns with your project requirements. Ensure compatibility with the specified SOT23 footprint dimensions during PCB layout. Review the latest datasheet revision history for any updates to electrical characteristics or marking codes before finalizing procurement.
Select this component for designs requiring a compact NPN transistor with high DC current gain suitable for low-current amplification tasks. The SOT23 package provides a space-efficient solution for surface-mount assembly. Consider the thermal resistance characteristics when designing for environments with limited heat dissipation capabilities. Verify that the operating temperature range meets the environmental conditions of the intended application.
The BC849C belongs to the Nexperia family of NPN general-purpose transistors designed for low-voltage, low-current applications. It serves as the complement to the BC859C PNP transistor. The device utilizes a silicon planar epitaxial structure within a leadless ultra-small SMD plastic package. This series is widely used in consumer electronics and industrial control systems where space constraints are critical.
Consult the official Nexperia documentation for verified substitute part numbers. Cross-reference pin configurations and electrical parameters such as VCEO and IC ratings to ensure functional equivalence. Verify package compatibility to avoid mechanical fit issues on existing PCB footprints.