BC857BLP-7

Overview

The BC857BLP-7 is a PNP small-signal transistor manufactured by Diodes Incorporated, housed in an X1-DFN1006-3 package. It features a collector-emitter voltage (VCEO) of -45 V and a maximum collector current (IC) of -100 mA. The device offers a power dissipation rating of 1000 mW when mounted on a 25mm x 25mm 2oz copper heatsink, with a thermal resistance (RθJA) of 120 °C/W under these conditions. Operating temperature ranges from -55°C to +150°C.

Feature Summary

• High power dissipation capability up to 1000 mW utilizing the exposed collector pad for thermal management.
• Extremely compact footprint of 0.60 mm², significantly reducing board space compared to traditional SOT23 packages.
• Low profile design with a maximum height of 0.5 mm to minimize off-board vertical clearance requirements.
• Qualified to JEDEC standards for high reliability and compliant with RoHS directives.

Applications

• General-purpose switching applications requiring low-profile surface mount components.
• Automotive electronics systems where specific change control and high reliability are mandated.
• Signal amplification circuits operating within small-signal parameters.

Procurement Notes

Verify that the procurement channel is authorized by Diodes Incorporated to ensure product authenticity and warranty coverage. Confirm the specific reel size and packing quantity required for your assembly line, as options include 3,000 or 10,000 units per carrier. Ensure compatibility with moisture sensitivity level 1 handling procedures during storage and soldering processes.

Selection Notes

Select this component when board real estate is constrained due to its minimal package footprint. Consider the BC857BLP-7 over standard SOT23 devices if higher power dissipation is achievable through proper PCB copper layout. Verify that the application environment supports the specified operating temperature range and that ESD protection measures align with the HBM 4,000 V rating.

Part Context

This part belongs to the BC857BLP series of PNP transistors designed for surface-mount technology. It serves as the complementary counterpart to the BC847BLP NPN transistor. The series is engineered to replace larger legacy packages while maintaining robust electrical performance and thermal characteristics suitable for modern electronic designs.

Replacement Considerations

For automotive applications requiring strict change control, refer to the related Q-suffix parts qualified to AEC-Q100/101/104/200 standards. Direct pin-compatible replacements may exist from other manufacturers using the X1-DFN1006-3 package, but electrical parameters must be verified against the absolute maximum ratings provided in the datasheet.

FAQ

What is the thermal resistance of the BC857BLP-7?

The thermal resistance junction-to-ambient (RθJA) is 310 °C/W on a single-sided 1.6mm FR4 PCB, and 120 °C/W when mounted on a 25mm x 25mm 2oz copper heatsink.

Is the BC857BLP-7 suitable for automotive applications?

While the device is qualified to JEDEC standards for high reliability, specific automotive applications requiring AEC-Q qualification should utilize the dedicated Q-suffix variants listed by the manufacturer.

What is the maximum height of the X1-DFN1006-3 package?

The package has a maximum height of 0.5 mm, which helps minimize the off-board profile of the assembled circuit board.