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The BC858BL3E6327 is a PNP silicon audio frequency transistor from the BC858 series, manufactured by Infineon Technologies. It operates in a SOT-23 surface-mount package with a collector-emitter voltage of 30 V and a continuous collector current of 100 mA. The device features a transition frequency of 250 MHz and a maximum power dissipation of 250 mW at a case temperature of 128 °C. DC current gain ranges from 420 to 800 depending on the hFE group. It is qualified according to AEC Q101 standards.
Verify the specific hFE binning group (A, B, or C) required for your circuit design, as the datasheet defines distinct minimum gain thresholds for each group. Confirm that the SOT-23 package dimensions align with your PCB footprint requirements. Ensure thermal management strategies account for the 250 mW power dissipation limit at elevated case temperatures.
Select this component when low noise characteristics are critical for audio signal processing. The BC858BL3 variant offers specific mechanical marking codes compared to other BC858 packages. Consider the complementary NPN types within the BC846...BC850... series if push-pull configurations are needed for the design.
This part belongs to the BC856...BC860... family of PNP silicon transistors. The 'L3' suffix indicates the specific TSLP-3-1 package type associated with the BC858BL3 designation in the official documentation. It serves as a specialized alternative to standard SOT-23 versions for specific board layout constraints.
Direct substitutes include other BC858 variants such as BC858B or BC858BW, provided the package type matches the application requirements. Complementary NPN devices like BC848 can be used in paired configurations.