SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Nexperia BCX53-10,115 is a PNP medium power transistor housed in a SOT89 (SC-62) surface-mounted plastic package. It features an exposed heatsink for thermal management and supports a collector current of -1 A with a peak pulse capability of -2 A. The device operates with a collector-emitter voltage of -80 V and a collector-base voltage of -100 V. DC current gain (hFE) ranges from 63 to 160 at VCE = -2 V and IC = -150 mA. Transition frequency is typically 145 MHz.
Verify the specific ordering suffix matches the required gain bin, as the BCX53-10 variant specifies a defined hFE range. Confirm that the component retains its AEC-Q101 qualification status, noting that revision history indicates some products may have had this status removed. Ensure the SOT89 footprint aligns with the provided soldering guidelines for reliable assembly.
Select the BCX53-10 when a controlled DC current gain between 63 and 160 is required for stable biasing. This variant differs from the standard BCX53 and the higher-gain BCX53-16. Consider the exposed collector pad for thermal dissipation needs, as power ratings depend heavily on PCB copper area. Verify compatibility with high-side switching topologies requiring PNP polarity.
This component belongs to the BCX53 series of PNP medium power transistors manufactured by Nexperia. The series includes variants with different gain bins and packaging options. The BCX53-10 specifically targets applications needing moderate gain consistency. It shares the SOT89 package form factor with other mid-power discrete semiconductors in the manufacturer's portfolio.
BCX53-16,115
The DC current gain (hFE) for the BCX53-10 ranges from 63 to 160, measured at VCE = -2 V and IC = -150 mA.
According to the datasheet revision history, while the product was originally qualified under AEC-Q101, certain products in the series have had their automotive qualification status removed. Verification of the specific batch status is recommended.
The exposed heatsink on the collector pin provides excellent thermal and electrical conductivity, allowing for lower thermal resistance values when mounted on FR4 PCBs with adequate copper areas.