SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The BFG325/XR is an NPN silicon planar epitaxial transistor designed for Radio Frequency (RF) front-end applications in the GHz range. It features a 4-pin dual-emitter SOT143R plastic package with reverse pinning. Key electrical parameters include a collector-base voltage of 15 V, a collector-emitter voltage of 6 V, and a maximum DC collector current of 35 mA. The device exhibits a transition frequency of 14 GHz and a total power dissipation of 210 mW at a solder point temperature of 90 °C or less. Additional characteristics include a typical DC current gain of 100, a noise figure of 1.1 dB at 2 GHz, and a maximum power gain of 18.3 dB at 1.8 GHz.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific ordering suffix matches the required packaging format. Check the latest product status on official NXP Semiconductors resources to ensure availability and compliance with current specifications before finalizing procurement plans.
Select this component for designs requiring high-frequency performance up to 14 GHz with low noise characteristics. Ensure the circuit design accommodates the 6 V collector-emitter voltage limit and the 35 mA maximum DC collector current. Verify thermal management strategies to maintain the solder point temperature within the specified limits for optimal power dissipation.
This component belongs to the BFG series of NPN silicon planar epitaxial transistors manufactured by NXP Semiconductors. It is specifically engineered for wideband RF applications, offering a balance of high gain and low noise in a compact surface-mount package. The SOT143R package provides a standardized footprint for integration into modern electronic devices.
Consult official NXP documentation for verified substitute part numbers. Cross-referencing should be performed carefully to ensure compatibility with voltage, current, and frequency requirements.
The transition frequency is 14 GHz under conditions of IC = 15 mA, VCE = 3 V, f = 1 GHz, and Tamb = 25 °C.
The total power dissipation is 210 mW when the temperature at the soldering point of the collector pin is 90 °C or less.
It is housed in a 4-pin dual-emitter SOT143R plastic package with reverse pinning.