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The BLF6G10LS-160RN,11 is a 160 W LDMOS power transistor designed for base station applications in the 700 MHz to 1000 MHz frequency range. It features an earless flanged SOT502B ceramic package with two leads and integrated ESD protection. Typical performance at 920 MHz to 960 MHz includes 32 W average output power, 22.5 dB power gain, 27% drain efficiency, and -41 dBc ACPR under 2-carrier W-CDMA conditions (VDS = 32 V, IDq = 1200 mA). The device exhibits excellent ruggedness, supporting a VSWR of 10:1 through all phases at 160 W CW. Thermal resistance from junction to case is 0.44 K/W.
Verify the specific ordering suffix against official Ampleon documentation to ensure correct package configuration. Confirm that the component meets RoHS Directive 2002/95/EC requirements before integration. Ensure handling procedures account for electrostatic discharge sensitivity during transport and assembly.
Select this component for high-efficiency RF power amplifier designs operating between 700 MHz and 1000 MHz. Verify that the application circuit can maintain the recommended quiescent current and supply voltage. Ensure adequate thermal management is provided to keep the junction temperature within the specified maximum limit.
This part belongs to the BLF6G10 series of LDMOS power transistors manufactured by Ampleon USA Inc. The LS variant specifically denotes the earless flanged SOT502B package, distinguishing it from the standard flanged version. It is engineered for robust performance in demanding cellular infrastructure environments.
Consult official Ampleon documentation for verified substitute part numbers. Do not assume cross-compatibility with other series without verifying pinout, electrical parameters, and package dimensions.
The device can withstand a load mismatch corresponding to a VSWR of 10:1 through all phases under specified operating conditions.
No, the transistor is internally matched for ease of use.
The thermal resistance from junction to case is 0.44 K/W.