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BSL302SNL6327HTSA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 30V 7.1A TSOP-6. Review the specifications below when checking this part for your BOM.
The BSL302SNL6327HTSA1 is a surface-mount N-channel MOSFET from Infineon Technologies, part of the OptiMOS series. It features a 30V drain-source voltage rating and supports a continuous drain current of 7.1A at ambient temperature. The device operates within a junction temperature range of -55°C to 150°C and dissipates up to 2W of power. Key electrical parameters include a maximum gate charge of 6.6nC at 5V, an input capacitance of 750pF at 15V, and a maximum on-resistance of 25mΩ at 10V gate drive. It is housed in a PG-TSOP6-6 package and holds AEC-Q101 automotive qualification.
This component has reached end-of-life status and is no longer manufactured by Infineon Technologies. Verification of availability should focus on existing stock or authorized distributors holding surplus inventory. Engineers must confirm the specific manufacturing date code and storage conditions when sourcing obsolete parts to ensure device integrity. Replacement strategies should be initiated immediately to mitigate supply chain risks associated with discontinued components.
Designers should evaluate the 30V voltage rating and 7.1A current capacity against circuit requirements. The 25mΩ on-resistance at 10V gate drive influences conduction losses. Consider the TSOP-6 package dimensions for PCB layout compatibility. Verify that the driving circuit can provide sufficient gate voltage to minimize resistance. Thermal management must account for the 2W power dissipation limit in the intended enclosure environment.
The BSL302SNL6327HTSA1 belongs to Infineon's OptiMOS family, which integrates advanced trench gate technology for improved switching characteristics. This specific part number denotes the N-channel variant with automotive qualification. The suffix indicates the specific tape and reel packaging configuration used for automated assembly processes in high-volume manufacturing environments.
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