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Product Detailed Parameters
- Description：IGBT MODULE 1200V
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.85V @ 15V, 10A
- Input：Three Phase Bridge Rectifier
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：20 A
- Power - Max：100 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：600 pF @ 25 V
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Overview
The BSM10GP120B9BOSA1 is a silicon IGBT module manufactured by Infineon Technologies, designed for high-power applications. It features a three-phase inverter configuration with a maximum collector-emitter voltage of 1200 V and a continuous collector current of 20 A at 25°C. The device utilizes the EconoPIM2 package style and supports screw mount installation. Key electrical parameters include a collector-emitter saturation voltage of 2.55 V, a gate-emitter leakage current of 300 nA, and a power dissipation rating of 100 W. The operational temperature range spans from -40°C to +125°C, with a maximum gate-emitter voltage limit of 20 V.
Feature Summary
- Three-phase inverter topology for efficient power conversion
- EconoPIM2 packaging for compact integration and thermal management
- Robust silicon IGBT technology ensuring reliable operation under high stress
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify component authenticity through authorized channels due to potential counterfeit risks. Confirm RoHS compliance status prior to procurement. Ensure storage conditions maintain integrity against moisture and static discharge. Validate datasheet revisions to match specific production batches. Check end-of-life status as availability may be restricted.
Selection Notes
Select this module when a 1200V rating and 20A current capacity are required for three-phase topologies. The EconoPIM2 form factor suits space-constrained designs needing screw-mount stability. Consider thermal resistance characteristics for heatsink sizing. Compare saturation voltage requirements against efficiency targets. Evaluate operating temperature limits for environmental compatibility.
Part Context
This component belongs to Infineon's IGBT module portfolio, specifically within the GP series utilizing TRENCHSTOP technology. It serves as a discrete power switching element distinct from intelligent power modules. The part number suffix indicates specific binning or revision details defined by the manufacturer. It complements other modules in the same family offering varying current ratings.
Replacement Considerations
BSM10GP120BOSA1 is listed as an alias for this part number. Verify pinout and parameter equivalence before substitution. Ensure mechanical dimensions match the existing PCB layout. Confirm thermal interface material compatibility for replacement assemblies.
