BSM150GD60DLC

Overview

The BSM150GD60DLC is a dual IGBT module with an integrated anti-parallel diode, manufactured by Infineon Technologies. It features a collector-emitter voltage (VCES) of 600 V and a nominal collector current (IC,nom.) of 150 A at Tc=55°C. The maximum repetitive peak collector current is 300 A. Total power dissipation reaches 570 W at Tc=25°C. The gate-emitter peak voltage is rated at +/- 20 V. The insulation test voltage is 2.5 kV RMS. Maximum junction temperature is 150 °C, with an operating temperature range from -40 °C to 125 °C.

Feature Summary

• Dual configuration integrating an IGBT transistor and an anti-parallel diode within a single insulated package.
• Designed for high-power switching applications requiring robust short-circuit capability and defined reverse bias safe operation area.
• Utilizes Econo3 packaging format to facilitate efficient thermal management and mechanical mounting.

Applications

• Induction heating systems
• Uninterruptible power supplies (UPS)
• Resonant converters

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm exact electrical characteristics and pinout compatibility. Ensure that the procurement channel provides valid traceability and authenticity certificates for this semiconductor component. Cross-reference the datasheet revision date to ensure alignment with current manufacturing specifications before finalizing purchase orders.

Selection Notes

Select this module based on its 600 V blocking voltage and 150 A continuous current rating suitable for medium-power industrial drives. Evaluate the thermal resistance parameters to design an appropriate heatsinking solution capable of maintaining junction temperatures below 150 °C under expected load conditions. Confirm that the drive circuitry can supply the required gate voltage levels without exceeding the +/- 20 V limit.

Part Context

This component belongs to the BSM series of IGBT modules originally developed by Siemens and later maintained under the EUPEC brand before becoming part of Infineon Technologies. The 'GD' designation typically indicates a specific generation or characteristic set within the broader BSM family, while 'DLC' denotes the specific packaging type used for these power modules.

Replacement Considerations

Direct replacements must match the 600 V / 150 A rating and Econo3 footprint. Verify equivalent thermal resistance and switching speed characteristics. Consult official cross-reference lists for confirmed substitutes such as other BSM series variants with identical pinouts and electrical limits.

FAQ

What is the maximum junction temperature for the BSM150GD60DLC?

The maximum junction temperature (Tvj) is specified as 150 °C in the technical data sheet.

Does this module include internal snubber capacitors?

No, the datasheet does not list internal snubber capacitors; external components may be required depending on the application circuit design.

What is the recommended mounting torque for the module?

The recommended mounting torque for the mechanical fastening is 4 Nm.