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The BSM35GD120DN2E3224BPSA1 is an N-channel Insulated Gate Bipolar Transistor (IGBT) module manufactured by Infineon Technologies. It features a six-element bridge configuration with built-in diodes housed in an EconoPACK 2 flange mount package. The device supports a maximum collector-emitter voltage of 1200 V and a continuous collector current of 50 A at 25°C. Key electrical parameters include a saturation voltage of 2.7 V, a power dissipation rating of 280 W, and a gate-emitter leakage current of 150 nA. The operational temperature range spans from -40°C to +150°C.
Verify the specific suffix against official manufacturer documentation to confirm exact revision status. Cross-reference part numbers such as BSM35GD120DN2E3224 to ensure compatibility with existing system designs. Confirm RoHS compliance details directly with the supplier or manufacturer datasheet prior to procurement.
Select this component for applications requiring high voltage isolation and moderate current handling within a compact form factor. Ensure the cooling solution accommodates the 280 W power dissipation limit. Verify that the drive circuitry provides appropriate gate voltage levels within the specified 20 V maximum rating.
This module belongs to Infineon's IGBT Silicon Modules product line, specifically designed for power conversion applications. It utilizes silicon technology to deliver reliable performance in high-power switching scenarios. The EconoPACK 2 packaging standardizes mounting dimensions for widespread integration into various power electronic architectures.
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Infineon replacement guides for verified alternatives.