BSM35GP120GBOSA1

Overview

The BSM35GP120GBOSA1 is a 1200 V, 35 A single IGBT module from the PrimePACK™ 3 family. It integrates an NTC thermistor for thermal monitoring and utilizes Field-Stop (FS) Trench technology to optimize switching performance. The module features a copper baseplate with a sintered silver die attach process for enhanced thermal cycling reliability. Key electrical parameters include a maximum collector-emitter saturation voltage of 2.45 V at 75°C and a typical turn-off energy of 18 mJ at 600 V and 70 A. It operates within a junction temperature range of -40 °C to +175 °C.

Feature Summary

• Integrates Field-Stop Trench IGBT technology for low conduction losses and optimized switching characteristics.
• Features a robust copper baseplate design with sintered silver interconnects to improve thermal conductivity and power cycling capability.
• Includes an integrated negative temperature coefficient (NTC) thermistor for precise real-time junction temperature monitoring.

Applications

• Industrial motor drives and servo systems
• Uninterruptible power supplies (UPS)
• High-efficiency switched-mode power supplies

Procurement Notes

Verify the specific suffix 'OSA1' against official Infineon documentation to confirm terminal plating and packaging configuration. Ensure the requested quantity matches the standard shipping unit defined in the current product qualification report. Cross-reference the manufacturing date code to confirm availability status, as component lifecycles may affect immediate supply.

Selection Notes

Select this module when designing systems requiring high power density and reliable thermal management under continuous load. The 35 A rating at 1200 V suits medium-power applications where efficiency is critical. Verify that the gate drive circuitry supports the specified input capacitance and peak gate current requirements to ensure safe operating area compliance during transient events.

Part Context

This component belongs to the PrimePACK™ 3 series, designed for industrial applications demanding high reliability. It replaces older PrimePACK designs by offering improved thermal resistance and higher current density. The module is part of Infineon's broader portfolio of insulated gate bipolar transistors aimed at reducing system size and weight through advanced packaging technologies.

Replacement Considerations

Direct pin-to-pin replacements within the same voltage and current class should be verified against the latest mechanical drawing. Alternative modules from the same family may offer different switching speeds or thermal characteristics. Confirm that any substitute part maintains compatibility with the existing heatsink interface and mounting torque specifications.