BSM50GP60BOSA1

Description：IGBT MODULE 600V 70A 250W
Series：-

SKU:a3dccb855ebf Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 70A 250W
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：Full Bridge
Vce(on) (Max) @ Vge, Ic：2.75V @ 15V, 25A
Input：Three Phase Bridge Rectifier
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 125°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：70 A
Power - Max：250 W
Current - Collector Cutoff (Max)：500 µA
Input Capacitance (Cies) @ Vce：1.1 nF @ 25 V

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BSM50GP60BOSA1

Overview

The BSM50GP60BOSA1 is a silicon IGBT module manufactured by Infineon Technologies, belonging to the EconoPIM2 series. It features a hex configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 70 A at 25°C. The saturation voltage is 2.2 V, and power dissipation reaches 250 W. Operating temperatures range from -40°C to +125°C, with a maximum gate-emitter voltage of 20 V. The component utilizes screw mount installation within an EconoPIM2 package.

Feature Summary

Hex configuration integrating multiple switching elements for compact circuit design
EconoPIM2 packaging optimized for efficient thermal management and mechanical stability
Silicon-based construction ensuring robust performance under high voltage conditions

Applications

Three-phase inverter circuits
Motor drive systems
Uninterruptible power supplies

Procurement Notes

Verify part authenticity through authorized channels as this component may be subject to obsolescence. Confirm RoHS compliance status and specific ordering suffixes against official datasheets before procurement. Ensure supply chain partners provide traceability documentation to mitigate risks associated with discontinued or limited availability inventory.

Selection Notes

Select this module for applications requiring 600V isolation and moderate current handling within a compact form factor. Evaluate thermal resistance requirements against the 250W dissipation limit. Compare alternative configurations such as full bridge variants if circuit topology demands differ. Ensure gate drive compatibility with the specified 20V maximum rating.

Part Context

This component is part of Infineon's broader EconoPIM family, designed for power conversion efficiency. It shares architectural similarities with other modules like the BSM50GP120 but differs in voltage ratings and package dimensions. The BOSA1 suffix indicates specific manufacturing and testing standards defined by the original equipment manufacturer.