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Product Detailed Parameters
- Description：IGBT MODULE 600V 70A 250W
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.55V @ 15V, 50A
- Input：Three Phase Bridge Rectifier
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：70 A
- Power - Max：250 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：2.8 nF @ 25 V
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Overview
The BSM50GP60GBOSA1 is a silicon IGBT module manufactured by Infineon Technologies, belonging to the EconoDUAL family. It features a Hex configuration and is housed in an EconoDUAL2 package with screw mount installation. The device supports a maximum collector-emitter voltage of 600 V and a continuous collector current of 70 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 2.2 V, a gate-emitter leakage current of 300 nA, and a maximum power dissipation of 250 W. The operating temperature range spans from -40°C to +125°C, with a maximum gate-emitter voltage of 20 V.
Feature Summary
- Hex configuration integrating multiple switching elements within a single compact module.
- EconoDUAL2 packaging designed for efficient thermal management and robust mechanical mounting.
- Silicon-based technology optimized for high-power industrial applications.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the exact part number suffix against official Infineon documentation, as variations such as BOSA1 may exist. Confirm availability status, as this component may be discontinued or subject to limited supply. Ensure compliance with RoHS directives if required by your specific application standards before procurement.
Selection Notes
Select this module based on its 600V rating and 70A continuous current capability. Consider the 2.2V saturation voltage for conduction loss calculations. Verify that the EconoDUAL2 footprint matches your PCB design and that the thermal resistance allows for adequate heat sinking within the specified 125°C junction temperature limit.
Part Context
This component is part of Infineon's broader EconoDUAL series of power modules. It shares common packaging and interface characteristics with other devices in the line but is distinguished by its specific 600V/70A ratings and Hex topology. It serves as a discrete solution compared to larger PIM configurations like the BSM50GP60.
Replacement Considerations
Check for direct replacements within the same EconoDUAL2 family with identical pinouts and ratings. Cross-reference with newer generations of Infineon IGBT modules that offer improved switching characteristics while maintaining mechanical compatibility.
