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The BSS192PH6327XTSA1 is a P-channel enhancement-mode MOSFET from Infineon's SIPMOS series, housed in a PG-SOT89 (SOT-89-3) surface-mount package. It features a drain-source breakdown voltage of -250 V and a continuous drain current of -0.19 A at 25°C ambient temperature. The device exhibits a maximum on-state resistance of 12 Ω at VGS = -10 V and ID = -0.19 A. It supports a power dissipation of 1 W at 25°C and operates within a junction temperature range of -55°C to +150°C. The component is qualified according to AEC-Q101 standards.
Verify the specific ordering suffix H6327 corresponds to the required tape and reel packaging quantity of 1000 pieces per reel. Confirm that the AEC-Q101 qualification status meets the specific reliability requirements for automotive or industrial deployment. Ensure the PG-SOT89 footprint matches the target PCB layout constraints before finalizing procurement orders.
Select this component when a single P-channel transistor with high voltage blocking capability (-250 V) is required in a compact SOT-89-3 form factor. Consider the relatively high on-resistance (up to 12 Ω) which limits suitability for high-current continuous loads. Evaluate thermal derating curves if operating above 25°C ambient temperature to ensure power dissipation limits are not exceeded.
This part belongs to Infineon's SIPMOS small-signal transistor family, designed for general-purpose switching. The BSS192P variant specifically targets high-voltage P-channel applications where moderate current handling is sufficient. It complements N-channel counterparts like the BSS606NH6327XTSA1 in complementary bridge configurations.
Direct replacements must match the -250 V rating, P-channel polarity, and SOT-89-3 package. Verify pinout compatibility (Gate-Drain-Source) as variations exist across manufacturers. Cross-reference thermal resistance values to ensure equivalent heat dissipation capabilities under identical mounting conditions.