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Product Detailed Parameters
- Description：MOSFET N-CH 40V 40A LFPAK33
- Series：-
- Mfr：Nexperia USA Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：40 V
- Current - Continuous Drain (Id) @ 25°C：40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：10V
- Rds On (Max) @ Id, Vgs：8.5mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id：3.6V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：20 nC @ 10 V
- Vgs (Max)：+20V, -10V
- Input Capacitance (Ciss) (Max) @ Vds：1309 pF @ 25 V
- FET Feature：-
- Power Dissipation (Max)：59W (Tc)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：LFPAK33
- Package / Case：SOT-1210, 8-LFPAK33 (5-Lead)
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Overview
The BUK7M8R5-40HX is an automotive qualified standard level N-channel MOSFET utilizing Trench 9 superjunction technology. It features a drain-source voltage of 40 V and a maximum on-state resistance of 8.5 mΩ at 25 °C. The device supports a continuous drain current of 40 A and dissipates up to 59 W of power. Packaged in the LFPAK33 (SOT1210) format with gull wing leads, it operates within a junction temperature range of -55 °C to +175 °C.
Feature Summary
- Fully automotive qualified to AEC-Q101 standards for high performance applications
- Trench 9 superjunction technology enables low power losses and high power density
- LFPAK copper clip package technology provides high robustness and reliability
- Gull wing leads facilitate high manufacturability and automated optical inspection
Applications
- 12 V automotive systems
- Powertrain, chassis, body and infotainment applications
- Medium/Low power motor drive
- DC-DC systems
- LED lighting
Procurement Notes
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct packaging configuration. Confirm that the component meets the required AEC-Q101 qualification status for your target automotive application. Cross-reference the marking code 78H540 with the datasheet to authenticate the part number during incoming inspection.
Selection Notes
Select this component when designing circuits requiring automotive-grade reliability and operation up to 175 °C. The LFPAK33 package is suitable for applications needing efficient thermal management via the mounting base. Ensure gate drive voltages align with the standard level requirements to achieve the specified low on-state resistance characteristics.
Part Context
This device belongs to Nexperia's BUK7 series of automotive MOSFETs. It employs Trench 9 technology to deliver enhanced power density compared to previous generations. The LFPAK33 package variant offers a compact footprint with improved solder joint reliability through its gull wing lead design, distinguishing it from traditional QFN packages.
Replacement Considerations
Consult the official Nexperia replacement guide for verified substitute part numbers. Do not assume pin compatibility or electrical equivalence with other MOSFETs without explicit manufacturer confirmation.
