BUK7S1R5-40HJ

$1.61

Description：MOSFET N-CH 40V 260A LFPAK88
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:fda525ffd815 Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：MOSFET N-CH 40V 260A LFPAK88
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：40 V
Current - Continuous Drain (Id) @ 25°C：260A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：10V
Rds On (Max) @ Id, Vgs：1.5mOhm @ 25A, 10V
Vgs(th) (Max) @ Id：3.6V @ 1mA
Gate Charge (Qg) (Max) @ Vgs：93 nC @ 10 V
Vgs (Max)：+20V, -10V
Input Capacitance (Ciss) (Max) @ Vds：6712 pF @ 25 V
FET Feature：-
Power Dissipation (Max)：242W (Tc)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：LFPAK88 (SOT1235)
Package / Case：SOT-1235

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BUK7S1R5-40HJ

Overview

The BUK7S1R5-40HJ is an automotive qualified N-channel MOSFET utilizing Trench 9 superjunction technology in a copper-clip LFPAK88 (SOT1235) package. It features a drain-source voltage of 40 V and a maximum continuous drain current of 260 A at 25 °C mounting base temperature. The device exhibits a typical on-state resistance of 1.24 mΩ at 25 °C, rising to 2.69 mΩ at 175 °C. Total power dissipation reaches 242 W under specified conditions. Thermal resistance from junction to mounting base is typically 0.54 K/W. Gate charge is typically 67 nC, with a threshold voltage range of 1 V to 3.6 V.

Feature Summary

Fully automotive qualified to beyond AEC-Q101 standards for thermally demanding environments
LFPAK88 copper clip technology provides improved thermal efficiency and current spreading
Trench 9 superjunction platform enables lower on-state resistance within the same footprint
Flexible gull wing leads enhance board level reliability against mechanical stress

Applications

12 V automotive systems
48 V DC/DC systems on 12 V secondary side
Higher power motors, lamps and solenoid control
Reverse polarity protection
LED lighting

Procurement Notes

Verify the specific ordering suffix 'J' against the manufacturer's official documentation to confirm packaging details, as datasheets may list standard variants without suffix specifications. Confirm RoHS compliance status and REACH SVHC declarations directly from the latest product database or chemical content reports provided by Nexperia before finalizing procurement orders.

Selection Notes

Select this component for high-power density automotive designs requiring robust thermal performance. The LFPAK88 package offers a smaller footprint compared to older wire bond packages like D²PAK. Ensure PCB thermal design supports the 260 A capability, as practical limits depend on board layout. The tight threshold voltage limits facilitate easy paralleling of multiple devices for higher current applications.

Part Context

This device belongs to Nexperia's BUK7S series of automotive qualified N-channel MOSFETs. It utilizes the company's proprietary Trench 9 low ohmic superjunction technology. The LFPAK88 package is designed specifically for space-constrained, high-power automotive applications, replacing traditional wire bond packages to improve power density and thermal management capabilities.