BUK7S2R5-40HJ

$1.69

Description：BUK7S2R5-40H/SOT1235/LFPAK88
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:51b55ccfe0a7 Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：BUK7S2R5-40H/SOT1235/LFPAK88
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：40 V
Current - Continuous Drain (Id) @ 25°C：140A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：10V
Rds On (Max) @ Id, Vgs：2.51mOhm @ 25A, 10V
Vgs(th) (Max) @ Id：3.6V @ 1mA
Gate Charge (Qg) (Max) @ Vgs：54 nC @ 10 V
Vgs (Max)：+20V, -10V
Input Capacitance (Ciss) (Max) @ Vds：3793 pF @ 25 V
FET Feature：-
Power Dissipation (Max)：135W (Tc)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：LFPAK88 (SOT1235)
Package / Case：SOT-1235

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BUK7S2R5-40HJ

Overview

The BUK7S2R5-40HJ is an automotive qualified N-channel MOSFET utilizing Trench 9 superjunction technology in a copper-clip LFPAK88 package. It features a drain-source voltage of 40 V and a continuous drain current of 140 A at 25 °C mounting base temperature. The typical on-state resistance is 2.51 mΩ at 25 °C, rising to 5.47 mΩ at 175 °C. Total power dissipation reaches 135 W. The device supports junction temperatures from -55 °C to +175 °C and includes avalanche ruggedness rated at 80 mJ.

Feature Summary

Fully automotive qualified beyond AEC-Q101 standards for high reliability
LFPAK88 copper-clip package provides low thermal resistance and improved current spreading
Trench 9 superjunction technology enables lower on-resistance and enhanced safe operating area
Gull wing leads absorb mechanical stress and allow visual solder inspection

Applications

12 V automotive systems
48 V DC/DC systems (on 12 V secondary side)
Higher power motors, lamps and solenoid control
Reverse polarity protection
Ultra high performance power switching

Procurement Notes

Verify the specific ordering suffix against official Nexperia documentation to confirm exact packaging configuration. Ensure the component meets the required automotive qualification standards for the target application environment. Cross-reference the marking code with the datasheet to validate authenticity upon receipt.

Selection Notes

Select this component for space-constrained high-power automotive designs requiring robust thermal management. The LFPAK88 package offers a smaller footprint compared to older wire bond packages while maintaining high current capability. Consider the tight threshold voltage limits if paralleling multiple devices is necessary for the circuit design.

Part Context

This part belongs to the BUK7S series of N-channel MOSFETs from Nexperia. It utilizes the SOT1235 package outline, commonly referred to as LFPAK88. The device is designed specifically for demanding automotive environments, leveraging advanced silicon technologies to achieve superior efficiency and durability compared to standard TrenchMOS alternatives.