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The BUK7Y10-30B is a standard level N-channel enhancement mode Field-Effect Transistor utilizing Nexperia's High-Performance Automotive TrenchMOS technology. It features a drain-source voltage of 30 V and a continuous drain current of 67 A at 25 °C mounting base temperature. The device exhibits a maximum on-state resistance of 10 mΩ at VGS = 10 V and ID = 25 A. Total power dissipation reaches 85 W with a mounting base temperature of 25 °C. The component supports junction temperatures up to 175 °C and includes an integrated source-drain diode.
Verify the specific ordering suffix against official Nexperia documentation to confirm package variant and tape-and-reel specifications. Confirm that the requested part number matches the exact electrical characteristics required for the target application. Ensure compatibility with the SOT669 (LFPAK) footprint during PCB layout. Cross-reference the latest datasheet revision to validate thermal and switching parameters before finalizing procurement.
Select this component for circuits requiring robust performance in automotive environments where standard gate drive voltages are utilized. The low on-state resistance minimizes conduction losses in high-current paths. Verify that the system's thermal management can support the specified power dissipation limits. Ensure the operating voltage remains within the 30 V drain-source rating to prevent breakdown.
This device belongs to the BUK7Y series of N-channel TrenchMOS FETs designed by Nexperia. The series utilizes HPA TrenchMOS technology to achieve high reliability and performance suitable for automotive use. The BUK7Y10-30B specifically targets applications requiring 30 V blocking capability and high current handling in a compact surface-mount package.
Consult official Nexperia substitution guides or distributor cross-reference tools for verified equivalent parts. Do not assume functional interchangeability based solely on package similarity or generic voltage ratings. Verify that any substitute meets the same AEC-Q101 qualification and thermal requirements.