BUK98150-55A,135

$0.42

Description：MOSFET N-CH 55V 5.5A SOT-223
Series：TrenchMOS™
Mfr：NXP USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:3b1473ce7e89 Category: Single FETs, MOSFETs Brand: NXP USA Inc.

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Product introduction

Product Detailed Parameters

Description：MOSFET N-CH 55V 5.5A SOT-223
Series：TrenchMOS™
Mfr：NXP USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：55 V
Current - Continuous Drain (Id) @ 25°C：5.5A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
Rds On (Max) @ Id, Vgs：137mOhm @ 5A, 10V
Vgs(th) (Max) @ Id：2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs：5.3 nC @ 5 V
Vgs (Max)：±15V
Input Capacitance (Ciss) (Max) @ Vds：320 pF @ 25 V
FET Feature：-
Power Dissipation (Max)：8W (Tc)
Operating Temperature：-55°C ~ 150°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：SC-73
Package / Case：TO-261-4, TO-261AA

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BUK98150-55A,135

Overview

The BUK98150-55A is an N-channel TrenchMOS logic level FET designed for automotive and general power switching. It features a 55 V drain-source voltage (VDS) and supports a continuous drain current (ID) of 5.5 A at 25 °C. The device exhibits low on-state resistance, with a maximum RDS(on) of 137 mΩ at VGS = 10 V and ID = 5 A. Total power dissipation reaches 8 W at a solder point temperature of 25 °C. It operates within a junction temperature range of -55 °C to 150 °C and is qualified to the AEC-Q101 standard.

Feature Summary

Logic level gate drive compatibility
Automotive qualification compliant with AEC-Q101
Low conduction losses via optimized on-state resistance

Applications

12 V and 24 V load switching
Automotive power management circuits
General purpose power switching applications
Motor, lamp, and solenoid control

Procurement Notes

Verify the specific ordering suffix against the manufacturer's latest documentation to ensure correct package and marking specifications. Confirm that the component meets the required AEC-Q101 grade for the intended automotive application. Cross-reference the datasheet revision date with the production batch to account for any potential design or material changes issued through Product Change Notices.

Selection Notes

Select this component when designing circuits requiring direct logic-level interface without additional gate drivers. Ensure the thermal design accommodates the 15 K/W junction-to-solder-point thermal resistance to maintain safe operating temperatures under high load conditions. Verify that the peak drain current requirements do not exceed the pulsed limits defined in the safe operating area curves.

Part Context

This part belongs to the Nexperia BUK98150 series of N-channel enhancement mode MOSFETs. It utilizes TrenchMOS technology to achieve improved performance characteristics compared to standard planar devices. The SOT223 (SC-73) package provides a compact surface-mount solution suitable for automated assembly processes in consumer and industrial electronics manufacturing.