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Product Detailed Parameters
- Description：MOSFET N-CH 40V 40A LFPAK33
- Series：-
- Mfr：Nexperia USA Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：40 V
- Current - Continuous Drain (Id) @ 25°C：40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
- Rds On (Max) @ Id, Vgs：8.5mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id：2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：28 nC @ 10 V
- Vgs (Max)：±16V
- Input Capacitance (Ciss) (Max) @ Vds：1800 pF @ 25 V
- FET Feature：-
- Power Dissipation (Max)：59W (Tc)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：LFPAK33
- Package / Case：SOT-1210, 8-LFPAK33 (5-Lead)
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Overview
The BUK9M8R5-40HX is an automotive qualified logic level N-channel MOSFET utilizing Trench 9 superjunction technology. It features a maximum drain-source voltage of 40 V and a typical on-state resistance of 7.2 mΩ at VGS = 10 V. The device supports a continuous drain current of 40 A and dissipates up to 59 W. Packaged in LFPAK33 (SOT1210), it operates within a junction temperature range of -55 °C to +175 °C.
Feature Summary
- Fully automotive qualified to AEC-Q101 standards for high performance applications
- Trench 9 superjunction technology enables low power losses and high power density
- LFPAK copper clip package technology provides high robustness and reliability
- Gull wing leads facilitate high manufacturability and automated optical inspection
Applications
- 12 V automotive systems
- Powertrain, chassis, body and infotainment applications
- Medium/Low power motor drive
- DC-DC systems
- LED lighting
Procurement Notes
Verify the specific ordering suffix against official Nexperia documentation to confirm packaging details such as reel or cut tape configuration. Ensure the component matches the required AEC-Q101 qualification status for your target automotive application environment before finalizing procurement orders.
Selection Notes
Select this component for designs requiring logic level gate drive compatibility with low RDS(on) in a compact surface mount footprint. The LFPAK33 package offers improved thermal performance compared to traditional wire bond packages, making it suitable for space-constrained automotive PCB layouts.
Part Context
This part belongs to Nexperia's BUK9 series of automotive-grade MOSFETs. It utilizes the LFPAK33 (SOT1210) plastic single-ended surface mounted package variant. The device is designed to meet rigorous automotive reliability standards while providing efficient power switching capabilities.
Replacement Considerations
Consult official Nexperia substitution guides for verified equivalents. Cross-reference pinout configurations and thermal characteristics when replacing existing components in established automotive circuit designs.
