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Product Detailed Parameters
- Description：BXK9R4R5-40H/SOT8038/MLPAK56
- Series：-
- Mfr：Nexperia USA Inc.
- Package：Tape & Reel (TR)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：40 V
- Current - Continuous Drain (Id) @ 25°C：91A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
- Rds On (Max) @ Id, Vgs：4.5mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id：2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：50 nC @ 10 V
- Vgs (Max)：±20V
- Input Capacitance (Ciss) (Max) @ Vds：3517 pF @ 25 V
- FET Feature：-
- Power Dissipation (Max)：71W (Tc)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：MLPAK56-WF
- Package / Case：8-PowerTDFN
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Overview
The BXK9R4R5-40HJ is a logic level N-channel MOSFET manufactured by Nexperia. It utilizes Trench 9 technology to achieve low on-resistance within a compact MLPAK56-WF (SOT8038-2) package. The device is designed for high performance and reliability, featuring side-wettable flanks to facilitate robust solder joints and automated optical inspection. This component meets AEC-Q101 qualification standards, ensuring suitability for demanding automotive environments.
Feature Summary
- Logic level N-channel MOSFET utilizing Trench 9 technology
- Qualified to AEC-Q101 requirements for high reliability
- Small footprint design suitable for compact applications
- Side-wettable flanks for robust soldering and visual inspection
Applications
- Motor drive systems
- Battery protection circuits
- DC-DC conversion modules
Procurement Notes
Verify the specific suffix 'J' against official Nexperia documentation to confirm tape-and-reel packaging or binning details. Ensure the part number matches the exact MLPAK56-WF variant. Cross-reference with authorized distributors to confirm current availability and lead times. Validate that the component meets all required automotive quality standards for the intended application environment.
Selection Notes
Select this component for designs requiring a small form factor with high thermal and electrical performance. The logic level gate drive simplifies control circuitry compared to standard threshold devices. Consider the AEC-Q101 qualification when designing for automotive durability. Evaluate the MLPAK56-WF package benefits for automated assembly processes requiring visual solder joint inspection.
Part Context
This part belongs to Nexperia's portfolio of automotive-grade power switches. It represents an evolution in trench MOSFET technology aimed at reducing conduction losses while maintaining a minimal physical footprint. The MLPAK56-WF package offers improved mechanical stability and thermal dissipation characteristics compared to traditional QFN packages, supporting high-current applications in constrained spaces.
