Diode Arrays BYV415J-600PQ product image

BYV415J-600PQ

$0.88
  • Description:DIODE ARRAYTO3PF
  • Series:-

SKU:326e4921e386 Category: Brand:

  
  • Quantity
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BYV415J-600PQ is listed in the Diode Arrays range at ChipApex. The manufacturer field lists WeEn Semiconductors. Its product description is DIODE ARRAYTO3PF. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for BYV415J-600PQ

  • Description:DIODE ARRAYTO3PF
  • Series:-
  • Mfr:WeEn Semiconductors
  • Package:Tube
  • Diode Configuration:-
  • Technology:-
  • Voltage - DC Reverse (Vr) (Max):-
  • Current - Average Rectified (Io) (per Diode):-
  • Voltage - Forward (Vf) (Max) @ If:-
  • Speed:-
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:-
  • Operating Temperature - Junction:-
  • Mounting Type:Through Hole
  • Package / Case:TO-3PFM, SC-93-3
  • Supplier Device Package:TO-3PF
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for BYV415J-600PQ

BYV415J-600PQ

Diode Arrays Overview

The BYV415J-600P is a dual ultrafast power diode manufactured by WeEn Semiconductors, housed in an isolated TO3PF plastic package. It features a maximum repetitive peak reverse voltage of 600 V and supports an average forward current of 15 A per diode at a heatsink temperature up to 101 °C. The device exhibits low leakage current and reduced switching losses for associated MOSFETs or IGBTs. Dynamic characteristics include a typical reverse recovery time of 67 ns at 25 °C and 106 ns at 125 °C under specified test conditions.

Diode Arrays Feature Summary

  • Very low on-state loss
  • Reduces switching losses in associated MOSFET or IGBT
  • Low leakage current
  • Isolated plastic package

Diode Arrays Applications

  • Active PFC in air conditioner
  • S.M.P.S Power Factor Correction (PFC)
  • Half-bridge/full-bridge switched-mode power supplies

Diode Arrays Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type and availability. Ensure the component meets the required thermal management specifications for the intended application environment. Cross-reference the datasheet revision date with the most recent product data sheet to confirm current production status and any potential specification updates before finalizing procurement decisions.

Diode Arrays Selection Notes

Select this component for high-frequency switching applications requiring fast recovery characteristics and low conduction losses. Evaluate the thermal resistance from junction to heatsink to ensure adequate cooling within the 175 °C junction temperature limit. Confirm that the circuit design accommodates the non-repetitive peak forward current ratings during transient events to prevent device stress.

Diode Arrays Part Context

This component belongs to the BYV415 series of dual ultrafast power diodes designed for efficient power conversion. The TO3PF package provides an isolated heatsink mounting option, facilitating thermal dissipation in high-power density designs. It serves as a specialized solution for rectification tasks where rapid switching speeds and minimal reverse recovery charge are critical for system efficiency.

Diode Arrays Replacement Considerations

Consult the official WeEn Semiconductors replacement guide for verified substitute part numbers. Ensure any alternative component matches the electrical ratings, pin configuration, and thermal performance requirements of the original design.

Diode Arrays FAQ

What is the maximum junction temperature for the BYV415J-600P?

The maximum junction temperature is 175 °C.

How is the device packaged?

It is housed in a TO3PF plastic single-ended package with an isolated heatsink mounted and one mounting hole.

What is the typical reverse recovery time at 125 °C?

The typical reverse recovery time is 106 ns when tested at IF = 15 A, VR = 200 V, and dIF/dt = 200 A/µs.

BYV415J-600PQBYV415J-600PQ
$0.88
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