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The Wolfspeed CAB004M12GM4T is a baseplate-less, half-bridge Silicon Carbide (SiC) power module featuring Gen4 technology with a soft body diode. It provides a drain-source voltage of 1200 V and an on-state resistance of 4 mΩ. The module supports a continuous drain current of 200 A at a heatsink temperature of 50 °C and a virtual junction temperature up to 175 °C. It utilizes press-fit pins for assembly and includes pre-applied phase change thermal interface material. Key electrical parameters include a maximum gate-source voltage of -10 V to +23 V transiently, a typical switching energy of 2.2 mJ turn-on and 1.0 mJ turn-off at 600 V/200 A, and a package stray inductance of 5.8 nH.
Verify the specific ordering suffix 'T' to confirm the inclusion of pre-applied phase change thermal interface material, as this distinguishes it from the non-T variant. Ensure compatibility with standard press-fit mounting tools and verify that the system design accounts for the specified 5.8 nH stray inductance. Confirm RoHS compliance status through official documentation prior to integration.
Select this module for applications requiring high power density and low thermal impedance due to its baseplate-less construction. The 4 mΩ on-resistance and soft body diode characteristics make it suitable for high-frequency operation. Designers must account for the 200 A continuous current limit imposed by the package at a 50 °C heatsink temperature and ensure gate drive voltages remain within the recommended operational range of -4 V to +15 V.
This component belongs to the Wolfspeed WolfPACK family of baseplate-less silicon carbide power modules. These modules are designed to meet industry-standard footprint requirements while offering enhanced thermal performance and scalability for medium-power applications. The family includes various configurations such as half-bridge, six-pack, and full-bridge topologies.
The CAB004M12GM4 serves as the direct functional equivalent without pre-applied thermal interface material. Substitution requires manual application of compatible thermal interface materials and verification of mounting torque specifications.