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The CBB021M12FM3 is a 1200 V, 21 mΩ Silicon Carbide full-bridge power module from Wolfspeed. It features four MOSFET positions with a maximum drain-source voltage of 1200 V and a typical on-state resistance of 21.0 mΩ at 25°C. The device supports a DC continuous drain current of 50 A at a heatsink temperature of 50°C and a virtual junction temperature up to 175°C. Key electrical parameters include a gate threshold voltage of 2.5 V typically, an internal gate resistance of 3.3 Ω, and a junction-to-heatsink thermal resistance of 1.15 °C/W when using pre-applied thermal interface material. The module includes an integrated NTC thermistor with a rated resistance of 5.0 kΩ at 25°C for thermal monitoring.
Verify the specific ordering suffix when purchasing. The base part number CBB021M12FM3 indicates the module without pre-applied phase change thermal interface material. The variant CBB021M12FM3T includes the pre-applied thermal interface material. Confirm the required version matches the thermal design requirements before procurement to ensure correct system integration.
Select this module for applications requiring high efficiency and compact form factors due to low stray inductance and fast switching characteristics. Ensure the gate driver provides the recommended +15 V turn-on voltage with ±5% regulation tolerance. Verify that the cooling solution maintains the heatsink temperature within limits to support the specified 50 A continuous current rating at the desired operating junction temperature.
This component belongs to the Wolfspeed WolfPACK family of silicon carbide power modules. It is designed as a full-bridge configuration containing four independent switch positions. The series utilizes press-fit terminals to reduce parasitic inductance compared to traditional screw-terminal packages, enhancing dynamic performance in high-frequency power conversion circuits.
Public datasheets do not list confirmed direct substitute part numbers. Engineers must evaluate alternative modules based on matching voltage ratings, current capabilities, package dimensions, and thermal resistance specifications to ensure compatibility with existing PCB layouts and cooling systems.