CCB021M12FM3

Overview

The CCB021M12FM3 is a Wolfspeed WolfPACK silicon carbide six-pack power module featuring Gen4 technology. It provides a 1200 V drain-source voltage and a typical on-state resistance of 21 mΩ per position. The module supports a DC continuous drain current of 30 A at a heatsink temperature of 50 °C, with a maximum virtual junction temperature of 175 °C. It utilizes press-fit pins for assembly and includes an integrated NTC thermistor rated at 5.0 kΩ. The package dimensions are 62.8 mm by 48 mm by 12.8 mm, weighing 21 g.

Feature Summary

• Six-pack topology integrating six independent SiC MOSFET positions within a single compact footprint.
• Gen4 technology implementation providing ultra-low switching losses and soft body diode characteristics.
• Press-fit pin configuration designed to facilitate automated assembly and reduce mechanical stress.
• Integrated NTC thermistor for precise internal thermal monitoring.

Applications

• DC-DC Converters
• High-Efficiency Converters and Inverters
• Renewable Energy Systems
• Smart-Grid and Grid-Tied Distributed Generation
• Electric Vehicle Chargers

Procurement Notes

Verify the specific ordering suffix when purchasing components. The base part number CCB021M12FM3 indicates the absence of pre-applied phase change thermal interface material. Conversely, the suffix T in CCB021M12FM3T denotes the inclusion of pre-applied thermal interface material. Ensure the correct variant matches the thermal management strategy defined in the system design specifications.

Selection Notes

Designers must account for the stray inductance of 17.4 nH between the DC+ and DC- terminals when calculating voltage overshoot during switching events. The module requires M4 bolts tightened to a torque range of 2.0 to 2.3 N-m for secure mounting. Thermal performance relies on maintaining the junction-to-heatsink thermal resistance below specified limits using appropriate cooling methods.

Part Context

This component belongs to the Wolfspeed WolfPACK FM3 series, which utilizes industry-standard 62mm form factors. It is engineered to replace traditional IGBT modules in medium-power applications, offering higher efficiency and power density. The six-pack architecture allows for versatile circuit topologies, including three-phase inverters and multi-level converters.

Replacement Considerations

Direct replacements within the same FM3 platform include CCB016M12FM3T and CCB032M12FM3T. These variants share identical physical dimensions and pinouts but differ in electrical ratings. Designers must verify that the alternative's current and resistance parameters align with the specific application requirements before substitution.

FAQ

What is the difference between CCB021M12FM3 and CCB021M12FM3T?

The primary distinction lies in the thermal interface material. The CCB021M12FM3 does not include pre-applied thermal interface material, whereas the CCB021M12FM3T comes with pre-applied phase change thermal interface material.

Is this module suitable for linear mode operation?

No. The datasheet explicitly states that the device is not intended for use in the linear region or linear mode operation.

How is the internal temperature monitored?

The module features an integrated NTC thermistor with a rated resistance of 5.0 kΩ at 25 °C, allowing for direct thermal feedback to the control system.