CLA4610-219

RF Diode Overview

The CLA4610-219 is a silicon PIN limiter diode from Skyworks Solutions, designed for Ka-band applications. It features a hermetically sealed ceramic package (O-CDMW-N2) with two terminals. Key electrical parameters include a minimum breakdown voltage of 80 V and a nominal junction capacitance of 0.2 pF. The device exhibits a maximum forward resistance of 2 Ω at a test current of 10 mA and 500 MHz. It has a nominal minority carrier lifetime of 0.01 µs. The component is lead-free, RoHS compliant, and classified under ECCN code EAR99.

RF Diode Feature Summary

• Hermetically sealed ceramic construction for environmental stability
• Ultra-low junction capacitance for minimal signal insertion loss
• High power handling capability for receiver protection
• Established Skyworks limiter diode process technology

RF Diode Applications

• Limiter circuits in low-noise amplifier (LNA) receiver stages
• Commercial radar systems requiring component protection
• Defense radar applications demanding high reliability

RF Diode Procurement Notes

Verify the specific datasheet version and any Product Change Notifications (PCNs) prior to procurement, as manufacturing sources for high-reliability components may change. Confirm that the hermetic seal integrity meets project requirements. Check for end-of-life status or discontinuation notices from Skyworks Solutions, Inc., as availability may be restricted. Ensure compatibility with existing assembly processes for ceramic packages.

RF Diode Selection Notes

Select this component when Ka-band operation and high breakdown voltage are required. Compare the 0.2 pF capacitance against system insertion loss budgets. Evaluate the thermal performance relative to the package type. Consider the 80 V minimum breakdown voltage for surge protection needs. Verify that the hermetic package is necessary for the operating environment compared to non-hermetic alternatives.

RF Diode Part Context

The CLA4610-219 belongs to the Skyworks CLA series of silicon limiter diodes. This series includes various packaged devices and bondable chips optimized for LNA protection. The product line utilizes established Skyworks processing techniques to achieve low insertion loss and high peak power handling. Other variants in the series differ primarily in breakdown voltage, capacitance, and packaging options.