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The CM100BU-12H is a single IGBT module manufactured by Powerex Inc. It features an N-channel Insulated Gate Bipolar Transistor paired with a reverse-connected super-fast recovery free-wheel diode. The device is rated for a maximum collector current of 100 A and a collector-emitter voltage of 600 V. It utilizes a flange mount package configuration with an isolated baseplate to facilitate thermal management and system assembly. The module is designed for high-frequency switching applications, typically operating between 20 kHz and 25 kHz.
Verify the specific manufacturer source when sourcing this component, as similar part numbers may be listed under different manufacturers such as Mitsubishi Electric Semiconductors due to historical industry relationships. Confirm that the received unit matches the Powerex specification sheet regarding pinout, isolation characteristics, and thermal interface requirements before integration into the final design.
Select the CM100BU-12H for applications requiring a single switch configuration with a 600 V rating and 100 A continuous current capacity. This module is appropriate where low drive power and high-frequency switching up to 25 kHz are required. Ensure the cooling solution supports the thermal dissipation needs of the flange mount package, as the isolated baseplate requires proper mounting torque and thermal interface material application.
This component belongs to the Powerex IGBTMOD series, which includes various configurations such as single (HA/HU), dual half-bridge (DU/DY), and three-phase (FU/FR) modules. The CM100BU-12H specifically denotes a single IGBT variant within the 600 V voltage class family, sharing design principles with other members like the CM400HA-12H but scaled for lower current applications.
Direct cross-manufacturer substitution should be verified against mechanical dimensions and electrical parameters. Similar single IGBT modules in the 600 V / 100 A range from other suppliers may require evaluation of gate threshold voltages, diode recovery times, and thermal resistance values to ensure compatibility with existing driver circuits and heatsink designs.