CM30TF-24H

Overview

The Powerex CM30TF-24H is a high-power Insulated Gate Bipolar Transistor (IGBT) module designed for demanding switching applications. It features a complex configuration with an integrated anti-parallel diode, rated for a maximum collector current of 30 Amperes and a collector-emitter breakdown voltage of 600 Volts. The component utilizes a flange mount package with a rectangular shape and isolated baseplate construction to facilitate efficient thermal management. It operates at a maximum junction temperature of 150 °C and includes discrete super-fast recovery free-wheeling diodes to support high-frequency operation.

Feature Summary

• Integrated IGBT and super-fast recovery diode in a single insulated module
• Isolated baseplate design for simplified heat sinking and system assembly
• Optimized for low drive power requirements and high-frequency switching

Applications

• AC motor control systems
• General purpose inverters
• Motion and servo control drives

Procurement Notes

Verify the specific manufacturer origin, as Powerex modules are often manufactured by Mitsubishi Electric Semiconductors. Confirm that the ordering suffix matches the required electrical characteristics and pinout configuration. Ensure compliance with RoHS directives if applicable to the target market, as older variants may not be certified. Validate the package dimensions against the mechanical drawing before integration.

Selection Notes

Select this module when a compact solution combining an IGBT and a fast recovery diode is required for medium-power inverter stages. The 600V rating suits lower voltage DC bus applications compared to higher voltage counterparts. Consider the thermal resistance and mounting torque specifications to ensure reliable long-term operation under continuous load conditions.

Part Context

This component belongs to the CM series of insulated gate bipolar transistor modules produced by Powerex. These modules are engineered for robust performance in industrial power conversion environments. The TF designation typically indicates a specific internal chip architecture optimized for switching speed and conduction losses within the series lineup.

Replacement Considerations

Cross-reference with the CM30TF-24D or similar variants from the same manufacturer family for potential functional equivalents. Verify that any substitute maintains the identical pinout and thermal interface dimensions to avoid PCB redesign.