CP372-WN

Description：MOSFET N-CH 60V DIE
Series：-
Mfr：Central Semiconductor Corp
Package：Bulk

SKU:1570a6a83e81 Category: Single FETs, MOSFETs Brand: Central Semiconductor Corp

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Product introduction

Product Detailed Parameters

Description：MOSFET N-CH 60V DIE
Series：-
Mfr：Central Semiconductor Corp
Package：Bulk
FET Type：-
Technology：-
Drain to Source Voltage (Vdss)：-
Current - Continuous Drain (Id) @ 25°C：-
Drive Voltage (Max Rds On, Min Rds On)：-
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：-
Gate Charge (Qg) (Max) @ Vgs：-
Vgs (Max)：-
Input Capacitance (Ciss) (Max) @ Vds：-
FET Feature：-
Power Dissipation (Max)：-
Operating Temperature：-
Grade：-
Qualification：-
Mounting Type：-
Supplier Device Package：-
Package / Case：-

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CP372-WN

Overview

The CP372-WN is an N-Channel enhancement-mode MOSFET bare die manufactured by Central Semiconductor Corp. It features a 37 x 63 mil die size and 7.5 mil thickness, optimized for power management and drive circuits. The device supports a maximum drain-source voltage of 60V and a continuous drain current of 5.3A at 25°C. Electrical characteristics include a typical on-resistance of 41mΩ at VGS=10V and a total gate charge of 8.8nC. The 'WN' suffix indicates the component is supplied as a full, unsawn wafer with 100% testing.

Feature Summary

Ultra-low profile geometry suitable for wire bond attachment
Optimized top metalization for standard die attach technologies
High drain current density with low on-resistance and gate charge

Applications

Power management systems
Load switching applications
Motor drives
DC-DC conversion

Procurement Notes

Verify that the CP372 process has been discontinued and transitioned to End of Life status per PDN01170. Confirm availability of remaining stock or consider the suggested replacement part number CP403-WN. Ensure ordering requirements align with the manufacturer's final shipment dates and any applicable minimum order quantities before placing orders.

Selection Notes

Select this component for designs requiring a bare die N-Channel MOSFET with specific electrical parameters such as 60V breakdown and 5.3A continuous current. Consider the physical dimensions of 37 x 63 mils and 7.5 mil thickness for integration into custom packages. Evaluate thermal performance within the -55 to +150°C operating range and verify compatibility with wire bonding processes.

Part Context

Central Semiconductor specializes in discrete semiconductor products, including bare dies available in various packaging formats. The CP372 belongs to their medium power MOSFET lineup designed for efficiency-critical applications. The company provides support through authorized distributors and direct sales channels, offering custom development services alongside standard product lines.

Replacement Considerations

The CP372 process is officially discontinued. The datasheet recommends the CP403-WN as the suggested replacement wafer process. Verify technical compatibility between the legacy CP372 and the CP403 series before implementation.