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The CSD13303W1015 is a single N-channel enhancement-mode power MOSFET from the NexFET series by Texas Instruments. It features a maximum drain-source voltage of 12 V and a continuous drain current of 3.5 A. The device utilizes a DSBGA surface-mount package with six pins, measuring 1.5 mm in length, 1 mm in width, and 0.38 mm in height. Key electrical parameters include a maximum on-resistance of 23 mΩ, a typical gate charge of 3.9 nC at 4.5 V, and a power dissipation rating of 1.65 W. The component operates within a temperature range of -55 °C to +150 °C.
Verify the specific ordering suffix matches the required tape-and-reel configuration. Confirm RoHS compliance status via the manufacturer datasheet. Ensure the DSBGA footprint dimensions align with the PCB layout requirements. Check for moisture sensitivity level ratings if reflow soldering is planned. Validate that the 12 V rating meets the system's peak voltage demands.
Select this component for applications requiring low voltage handling and compact surface-mount integration. The 12 V rating suits systems operating below this threshold. Consider the 23 mΩ on-resistance for minimizing conduction losses. Evaluate the 3.5 A current capacity against peak load requirements. The small DSBGA package is suitable for space-constrained designs.
This part belongs to the CSD13303W family of NexFET power MOSFETs. These components are designed for low-voltage, high-efficiency power conversion. The series emphasizes reduced on-resistance and fast switching speeds. They are commonly used in modern electronic devices requiring efficient power regulation.
Consult official substitution guides for compatible alternatives. Verify pinout compatibility before replacing. Ensure voltage and current ratings meet or exceed original specifications.