SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CSD18531Q5A is a 60V N-Channel NexFET Power MOSFET manufactured by Texas Instruments. It features an 8-VSONP (5x6) surface-mount package. The device supports a continuous drain current of 17A at ambient temperature and 100A at case temperature. Key electrical parameters include a maximum gate-source voltage of ±20V, a threshold voltage of 2.3V at 250µA, and a maximum gate charge of 36nC at 10V. The input capacitance is 2750pF at 30V. On-resistance is specified at 5.9mΩ at 18A and 10V. Power dissipation ratings are 3.2W at ambient and 116W at case temperatures. The operating junction temperature range extends from -55°C to 150°C.
Verify the specific suffix 'Q5A' against the manufacturer's official datasheet to confirm pinout and electrical specifications match your design requirements. Ensure the ordering part number corresponds to the correct tape-and-reel or cut-tape quantity as defined in the packaging section of the product documentation. Cross-reference the component marking with the datasheet visual identification guide to prevent counterfeit substitution during assembly.
Select this component when a 60V rating is sufficient for the application, offering lower cost compared to higher voltage variants. The 8-VSONP package is suitable for space-constrained designs requiring robust thermal performance. Evaluate the 5.9mΩ on-resistance against system efficiency targets and compare gate charge values with alternative devices to optimize switching losses in high-frequency operation scenarios.
This device belongs to the NexFET family of power MOSFETs from Texas Instruments. It shares the same voltage class and package type with other members like the CSD18533Q5A, but differs in specific on-resistance and current handling capabilities. The series is designed for general-purpose power switching applications requiring high reliability and thermal stability in compact form factors.
Direct substitutes within the same family include CSD18533Q5A and CSD18537NQ5A. Verify that the replacement part meets or exceeds the required on-resistance and current ratings. Ensure the package dimensions and thermal pad configuration remain compatible with the existing PCB footprint.