CY7C2268KV18-550BZC

Memory IC Overview

The CY7C2268KV18-550BZC is a 36-Mbit DDR II+ synchronous SRAM organized as 2M x 18. It supports a maximum clock frequency of 550 MHz with a two-word burst architecture and 2.5 cycle read latency. The device operates with a core voltage of 1.8 V ± 0.1 V and an I/O voltage range of 1.4 V to 1.9 V. It features on-die termination (ODT) for data, byte write selects, and input clocks. The component is housed in a 165-ball FBGA package measuring 13 × 15 × 1.4 mm.

Memory IC Feature Summary

• DDR II+ architecture with two-word burst capability for reduced address bus frequency
• Integrated on-die termination (ODT) for DQ, BWS, and clock inputs
• Echo clocks (CQ/CQ) and valid data indicator (QVLD) for simplified high-speed capture
• Programmable output impedance via ZQ pin for system bus matching

Memory IC Applications

• High-bandwidth networking equipment
• Telecommunications infrastructure
• Industrial automation systems

Memory IC Procurement Notes

Verify the specific ordering suffix matches the required package variant and temperature grade. Confirm that the procurement source provides official documentation referencing the Infineon or Cypress datasheet number 001-57845. Ensure compatibility with the specified 1.8 V core and variable I/O supply requirements during integration planning.

Memory IC Selection Notes

Select this component for applications requiring high throughput with low latency. The 550 MHz speed class suits demanding bandwidth needs. Consider the 2M x 18 organization for width expansion configurations. Verify that the system design accommodates the 165-ball FBGA footprint and the specific power supply sequencing requirements outlined in the datasheet.

Memory IC Part Context

This part belongs to the CY7C2268KV18 family of 36-Mbit DDR II+ SRAMs. It shares architectural similarities with other devices in the QDR/DDR II+ portfolio but is distinct in its 2M x 18 density and 550 MHz performance tier. The device represents the transition from Cypress Semiconductor to Infineon Technologies while maintaining functional continuity.

Memory IC Replacement Considerations

CY7C2270KV18-550BZXC offers equivalent performance with a 1M x 36 organization.