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Product Detailed Parameters
- Description：MOSFET 2N-CH 1200V 50A AG-EASY1B
- Series：EasyPACK™
- Mfr：Infineon Technologies
- Package：Tray
- Technology：Silicon Carbide (SiC)
- Configuration：2 N-Channel (Dual)
- FET Feature：-
- Drain to Source Voltage (Vdss)：1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C：50A (Tj)
- Rds On (Max) @ Id, Vgs：22.5mOhm @ 50A, 15V
- Vgs(th) (Max) @ Id：5.55V @ 20mA
- Gate Charge (Qg) (Max) @ Vgs：124nC @ 15V
- Input Capacitance (Ciss) (Max) @ Vds：3680pF @ 800V
- Power - Max：-
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-EASY1B-2
- Grade：-
- Qualification：-
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Overview
The DF11MR12W1M1PB11BPSA1 is a MOSFET module from Infineon Technologies, classified under discrete and power modules. It utilizes Silicon (Si) technology and belongs to the CoolSic family. The component features a Press Fit installation style and operates within a temperature range of -40°C to +150°C. It is designed for high-performance power conversion applications requiring robust thermal management and reliable switching characteristics.
Feature Summary
- Utilizes CoolSiC trench MOSFET technology for efficient power switching
- Incorporates PressFIT contact technology for secure mechanical mounting
- Integrates negative temperature coefficient (NTC) temperature sensor for thermal monitoring
Applications
- Modern power supply designs requiring compact integration
- High-efficiency power conversion systems
- Automotive power electronics applications
Procurement Notes
Verify current availability status as this product may be subject to limited supply or discontinuation notices. Confirm RoHS compliance details through official documentation. Ensure ordering suffixes match specific package and configuration requirements. Check regional sales restrictions before placing orders. Validate datasheet revisions for accurate electrical parameters.
Selection Notes
Select this module for applications demanding integrated thermal sensing and reliable press-fit connections. Consider the operating temperature range and silicon-based CoolSiC technology for suitable thermal performance. Verify compatibility with existing PCB layouts and cooling solutions. Review lifetime status to ensure long-term project viability.
Part Context
This component is part of Infineon's EasyPACK series, designed for compact and easily integrable packaging in modern power designs. It represents a segment of the company's portfolio focused on high-performance power modules utilizing advanced semiconductor technologies for efficient energy management.
Replacement Considerations
Check for direct substitutes within the EasyPACK series or compatible CoolSiC modules. Verify pinout and electrical parameter equivalence before substitution. Consult official replacement lists for discontinued variants.
