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Product Detailed Parameters
- Description：IGBT MOD 1200V 40A 20MW
- Series：EasyPACK™
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：1.7V @ 15V, 20A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：40 A
- Power - Max：-
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：2.35 nF @ 25 V
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Overview
The DF160R12W2H3FB11BPSA1 is a booster IGBT module from Infineon Technologies, utilizing High Speed IGBT H3 technology. It features a quad configuration with a maximum collector-emitter voltage of 1.2 kV and a continuous collector current of 20 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.55 V and operates within a junction temperature range of -40°C to +150°C. Packaged in the EasyPACK format with press-fit mounting, it includes an integrated NTC thermistor for thermal monitoring.
Feature Summary
- High-speed switching performance enabled by High Speed IGBT H3 technology
- Integrated NTC thermistor for precise thermal management
- Press-fit installation method for secure mechanical connection
Applications
- Booster circuits in power conversion systems
- Industrial motor drive applications
- Variable speed drive topologies
Procurement Notes
Verify the specific ordering suffix BPSA1 against official Infineon documentation to confirm exact manufacturing lot details and compliance status. Ensure compatibility with existing PCB layouts designed for EasyPACK modules. Confirm that the press-fit mounting requirements align with the assembly equipment specifications before procurement.
Selection Notes
Select this component when a booster configuration is required within a high-speed IGBT application. The 1.2 kV rating suits medium-voltage systems, while the 20 A current capacity defines its power handling limits. Consider the EasyPACK package dimensions and press-fit termination style during mechanical design integration.
Part Context
This module belongs to the High Speed IGBT H3 series, which represents advanced trench field-stop technology optimized for fast switching operations. The EasyPACK family provides standardized form factors for efficient thermal dissipation and reliable electrical connections in compact power electronic designs.
Replacement Considerations
Cross-reference with other Infineon EasyPACK booster modules sharing the same pinout and thermal characteristics. Verify that any substitute maintains equivalent switching speeds and voltage ratings to ensure system stability without redesigning the gate drive circuitry.
