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Product Detailed Parameters
- Description：IGBT MOD 1200V 30A 375W
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：2 Independent
- Vce(on) (Max) @ Vge, Ic：1.3V @ 15V, 30A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：30 A
- Power - Max：375 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：2 nF @ 25 V
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Overview
The DF200R12W1H3B27BOMA1 is a High Speed IGBT H3 chopper module from Infineon Technologies, housed in the EasyPACK package. It features an integrated NTC temperature sensor and utilizes PressFIT contact technology for mounting. The module operates with a collector-emitter voltage of 1200 V and a nominal continuous collector current of 30 A at 80°C case temperature. Key electrical parameters include a maximum repetitive peak reverse voltage of 1200 V, a surge forward current limit of 360 A, and a total power dissipation of 375 W. The junction-to-case thermal resistance is 0.40 K/W per IGBT.
Feature Summary
- Low switching losses achieved through High Speed IGBT H3 technology
- Al2O3 substrate providing low thermal resistance
- Integrated NTC temperature sensor for thermal monitoring
- Compact design utilizing PressFIT connection technology
Applications
- Solar applications
- Inverter circuits
- Brake-chopper circuits
Procurement Notes
Verify the specific ordering suffix B27BOMA1 against official documentation to confirm exact manufacturing specifications. Ensure compatibility with PressFIT assembly processes and verify that the required gate drive voltages align with the specified ±15 V operational limits. Confirm compliance with RoHS directives and UL approval standards E83335 before finalizing procurement.
Selection Notes
Select this component for applications requiring high reliability and low switching losses within solar or industrial inverter systems. Evaluate the thermal management requirements based on the specified junction-to-case thermal resistance and maximum operating temperatures. Ensure the system can accommodate the PressFIT mounting method and provides appropriate isolation testing capabilities as defined by the datasheet.
Part Context
This module belongs to the EasyPACK series of discrete and power modules manufactured by Infineon Technologies. It is part of the High Speed IGBT H3 product line, designed specifically for applications demanding efficient power conversion. The EasyPACK form factor allows for compact integration into various power electronic systems while maintaining robust mechanical and electrical performance characteristics.
Replacement Considerations
Consult official Infineon documentation for confirmed substitute part numbers. Verify that any replacement maintains equivalent voltage ratings, current capacities, and thermal characteristics. Ensure compatibility with existing PCB layouts and mounting technologies.
