DF419MR20W3M1HFB11BPSA1

$217.79

Description：MOSFET 4N-CH 2000V 50A AG-EASY3B
Series：EasyPACK™

SKU:7ea6a8aece95 Category: FET, MOSFET Arrays Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：MOSFET 4N-CH 2000V 50A AG-EASY3B
Series：EasyPACK™
Mfr：Infineon Technologies
Package：Tray
Technology：MOSFET (Metal Oxide)
Configuration：4 N-Channel
FET Feature：-
Drain to Source Voltage (Vdss)：2000V (2kV)
Current - Continuous Drain (Id) @ 25°C：50A (Tj)
Rds On (Max) @ Id, Vgs：26.5mOhm @ 60A, 18V
Vgs(th) (Max) @ Id：5.15V @ 34mA
Gate Charge (Qg) (Max) @ Vgs：234nC @ 18V
Input Capacitance (Ciss) (Max) @ Vds：7240pF @ 1.2kV
Power - Max：-
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：AG-EASY3B
Grade：-
Qualification：-

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DF419MR20W3M1HFB11BPSA1

Overview

The DF419MR20W3M1HFB11BPSA1 is a CoolSiC Trench MOSFET module in the EasyPACK package. It features a 2000 V drain-source voltage and a continuous DC current of 50 A at 175 °C, with a peak repetitive current of 120 A. The on-state resistance is typically 26.5 mΩ at 25 °C. The module includes an integrated NTC thermistor for temperature monitoring and utilizes PressFIT contact technology.

Feature Summary

Integrated NTC temperature sensor
PressFIT contact technology
Low inductive design

Applications

Solar applications

Procurement Notes

Verify the exact part number against official Infineon documentation to ensure compatibility with your specific application requirements. Confirm that the datasheet revision matches your design specifications. Check for any updates or notices regarding the product's qualification status before finalizing procurement decisions.

Selection Notes

Consider the thermal management requirements given the junction-to-heatsink thermal resistance values. Ensure the gate drive voltages align with the recommended operating conditions. Evaluate the stray inductance characteristics for high-frequency switching applications. Verify the insulation coordination parameters for safety compliance.

Part Context

This component belongs to the EasyPACK module series from Infineon Technologies, utilizing CoolSiC Trench MOSFET technology. It is designed for industrial applications and qualified according to IEC standards. The module integrates both MOSFETs and booster diodes within a single package.

Replacement Considerations

Consult official Infineon documentation for verified substitute part numbers. Do not assume cross-compatibility with other modules without verifying electrical and mechanical parameters.