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The DF900R12IP4DVBOSA1 is a PrimePACK™2 IGBT module utilizing Trench/Fieldstop IGBT4 technology with an enlarged Emitter Controlled 4 diode. It features a collector-emitter voltage (VCES) of 1200 V and a nominal continuous DC collector current (IC nom) of 900 A at TC = 100°C. The repetitive peak collector current (ICRM) reaches 1800 A for 1 ms pulses. Typical saturation voltage (VCEsat) is 2.05 V at Tvj = 150°C, while the diode forward voltage (VF) is 1.65 V at Tvj = 25°C. Thermal resistance from junction to case is 29.5 K/kW per IGBT and 37.0 K/kW per diode. The module includes an integrated NTC thermistor rated at 5.00 kΩ at 25°C.
Verify component authenticity through official Infineon channels or authorized distributors. Confirm RoHS compliance status and check for end-of-life notifications as this series may be subject to discontinuation. Ensure proper handling procedures are followed due to the sensitivity of semiconductor components to electrostatic discharge during installation.
Select based on thermal management requirements given the specific RthJC values. Verify gate drive compatibility with the specified internal gate resistor and threshold voltages. Ensure the application voltage does not exceed the 1200 V rating under transient conditions. Consider the mechanical mounting torque specifications for reliable electrical connections.
This component belongs to the PrimePACK™2 family designed for industrial applications. It represents an evolution in IGBT4 technology focusing on improved short-circuit robustness and reduced saturation voltage compared to previous generations. The package format allows for high power density integration in compact systems.
DF900R12IP4DV
The module supports a maximum short-circuit time (tP) of 10 µs at Tvj = 150°C with VCC = 800 V.
Yes, it integrates an NTC thermistor with a nominal resistance of 5.00 kΩ at 25°C for temperature monitoring.
At Ic = 900 A, Vce = 600 V, and Tvj = 150°C, the typical turn-off energy loss (Eoff) is 205 mJ.