DIP2450-01D3

RF Multiplexers Overview

The DIP2450-01D3 is an RF diplexer manufactured by STMicroelectronics, designed for dual-band wireless applications. It operates within the 2.4 GHz to 2.483 GHz and 4.9 GHz to 5.85 GHz frequency ranges. The component features a 50 Ohm impedance and utilizes a FlipChip-4 package with SMD/SMT termination style. It supports a minimum operating temperature of -40°C.

RF Multiplexers Feature Summary

• Provides signal separation between 2.4 GHz and 5 GHz bands
• Optimized for WLAN and Bluetooth integration
• Compact FlipChip-4 surface mount packaging

RF Multiplexers Applications

• Dual-band WLAN systems
• Bluetooth connectivity modules
• Combined WLAN/Bluetooth devices

RF Multiplexers Procurement Notes

Verify the specific package marking and date code against official STMicroelectronics documentation to ensure authenticity. Confirm that the FlipChip-4 footprint matches your PCB design requirements. Check for any recent product change notifications regarding assembly sites or material composition updates before finalizing procurement orders.

RF Multiplexers Selection Notes

Select this component when designing circuits requiring isolation between 2.4 GHz and 5 GHz RF paths. Ensure the system impedance aligns with the 50 Ohm specification. Consider the thermal performance limits relative to the -40°C minimum operating temperature constraint during board layout and environmental testing phases.

RF Multiplexers Part Context

This device belongs to STMicroelectronics' portfolio of RF multiplexers and diplexers. It complements other components in wireless communication subsystems, specifically targeting the growing demand for integrated dual-band solutions in consumer electronics and IoT devices where space and signal integrity are critical constraints.

RF Multiplexers Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Evaluate alternative diplexers from STMicroelectronics or other manufacturers based on identical frequency ranges and package dimensions if direct substitution is required.