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The DMN3350LDWQ-13 is a MOSFET array manufactured by Diodes Incorporated, housed in a surface-mount SOT-363 package. It features a drain-source breakdown voltage (BVDSS) range of 25V to 30V. The device supports a continuous drain current of 890mA at ambient temperature and provides a power dissipation capacity of 340mW under the same conditions. This component is designed for compact electronic applications requiring efficient switching capabilities within low-voltage operational parameters.
Verify the specific datasheet revision and electrical characteristics against the official Diodes Incorporated documentation prior to integration. Confirm that the SOT-363 footprint and pinout align with the target PCB layout requirements. Ensure compliance with relevant environmental standards such as RoHS directives applicable to the manufacturing batch.
Select this component when space-constrained designs require integrated MOSFET arrays rather than discrete single devices. Evaluate the 30V breakdown voltage and 890mA current rating against peak load requirements. Consider the 340mW thermal dissipation limit for adequate heat management within the intended operating environment.
This part belongs to Diodes Incorporated's portfolio of field-effect transistors, specifically targeting the MOSFET category. It serves as a solution for manufacturers seeking miniaturized components for modern electronic assemblies. The product line emphasizes high-quality semiconductor performance for automotive, industrial, and computing markets.
The DMN3350LDWQ-13 has a drain-source breakdown voltage (BVDSS) ranging from 25V to 30V.
The component is supplied in an SOT-363 surface-mount package.