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Product Detailed Parameters
- Description：MOSFET P-CH 30V 300MA SOT23
- Series：-
- Mfr：Diodes Incorporated
- Package：Tape & Reel (TR),Cut Tape (CT)
- FET Type：P-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：30 V
- Current - Continuous Drain (Id) @ 25°C：300mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
- Rds On (Max) @ Id, Vgs：2.4Ohm @ 300mA, 10V
- Vgs(th) (Max) @ Id：2.4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs：1.2 nC @ 10 V
- Vgs (Max)：±20V
- Input Capacitance (Ciss) (Max) @ Vds：51.16 pF @ 15 V
- FET Feature：-
- Power Dissipation (Max)：370mW (Ta)
- Operating Temperature：-55°C ~ 150°C (TJ)
- Grade：-
- Qualification：-
- Mounting Type：Surface Mount
- Supplier Device Package：SOT-23-3
- Package / Case：TO-236-3, SC-59, SOT-23-3
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Overview
The DMP32D4S-7 is a P-channel enhancement mode MOSFET designed for high-efficiency power management. It features a -30V drain-source voltage rating and an on-state resistance of 2.4Ω at VGS = -10V, or 4Ω at VGS = -4.5V. The device supports a continuous drain current of -300mA at +25°C and operates within a junction temperature range of -55°C to +150°C.
Feature Summary
- Low on-state resistance optimized for high-efficiency power management applications
- ESD protected gate structure
- Totally lead-free and fully RoHS compliant construction
Applications
- Load switches
- Portable applications
- Power-management functions
Procurement Notes
Verify the specific ordering suffix matches the required packing quantity. Confirm that the component meets all applicable environmental directives and quality standards relevant to the target deployment environment before finalizing procurement specifications.
Selection Notes
Select this component when a compact SOT23 package is required for low-current switching tasks. Ensure the gate drive voltage aligns with the specified thresholds to achieve the desired on-resistance characteristics during operation.
Part Context
This part belongs to Diodes Incorporated's portfolio of surface-mount power transistors. It utilizes a molded plastic package with a matte tin finish over an alloy leadframe, suitable for automated assembly processes in consumer and industrial electronics manufacturing.
Replacement Considerations
Consult official manufacturer documentation for qualified automotive-grade alternatives if AEC-Q100 compliance is required. Verify pinout compatibility and electrical parameters against any potential substitute components.
