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Product Detailed Parameters
- Description：MOSFET P-CH 30V 60A PWRDI5060-8
- Series：-
- Mfr：Diodes Incorporated
- Package：Tape & Reel (TR)
- FET Type：P-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：30 V
- Current - Continuous Drain (Id) @ 25°C：60A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
- Rds On (Max) @ Id, Vgs：7.5mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id：2.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs：139 nC @ 10 V
- Vgs (Max)：±20V
- Input Capacitance (Ciss) (Max) @ Vds：6807 pF @ 15 V
- FET Feature：-
- Power Dissipation (Max)：2.6W (Ta)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：PowerDI5060-8
- Package / Case：8-PowerTDFN
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Overview
The DMPH3010LPSQ-13 is a P-channel enhancement mode MOSFET designed for automotive applications. It features a -30V drain-source voltage and a continuous drain current of -60A at TC = +25°C. The device exhibits a maximum on-resistance of 7.5mΩ at VGS = -10V and 10mΩ at VGS = -4.5V. It operates within a temperature range of -55°C to +175°C and is housed in a PowerDI5060-8 package.
Feature Summary
- Qualified to AEC-Q101 standards with PPAP capability for high reliability
- Rated for operation up to +175°C junction temperature
- 100% unclamped inductive switching (UIS) tested in production
Applications
- DC-DC Converters
- Power Management Functions
- Reverse Polarity Protection
Procurement Notes
Verify the specific ordering suffix matches the required packaging configuration, as standard tape and reel quantities are specified. Confirm that the component meets all applicable RoHS directives and environmental compliance requirements relevant to your manufacturing region before finalizing procurement orders.
Selection Notes
Select this component when designing circuits requiring robust performance in high ambient temperature environments. Ensure gate drive voltages align with the specified thresholds for optimal on-resistance. Verify thermal management strategies accommodate the device's power dissipation limits under steady-state conditions.
Part Context
This part belongs to Diodes Incorporated's PowerDI series, utilizing a molded plastic case with a green molding compound. The package provides an exposed drain pad for efficient thermal transfer to the PCB substrate, supporting surface mount assembly processes.
Replacement Considerations
Consult official manufacturer documentation for verified substitute part numbers. Cross-referencing requires matching electrical parameters, package dimensions, and qualification standards to ensure functional compatibility.
