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DSM8100-000 is listed in the RF Diode range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is RF DIODE PIN 60V 250MW. Review the specifications below when checking this part for your BOM.
RF Diode specifications for DSM8100-000
- Description：RF DIODE PIN 60V 250MW
- Series：-
- Mfr：Skyworks Solutions Inc.
- Package：Tray
- Diode Type：PIN - Single
- Voltage - Peak Reverse (Max)：60V
- Current - Max：-
- Capacitance @ Vr, F：0.025pF @ 10V, 1MHz
- Resistance @ If, F：3.5Ohm @ 10mA, 100MHz
- Power Dissipation (Max)：250 mW
- Operating Temperature：-65°C ~ 150°C (TA)
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
RF Diode datasheet and documents for DSM8100-000
RF Diode Overview
The DSM8100-000 is a Mesa Beam-Lead PIN diode designed for switching applications. It features low capacitance, low resistance, and fast switching time. The device has a voltage rating of 60 V, maximum total capacitance of 0.025 pF at 10 V reverse bias and 1 MHz, and maximum series resistance of 3.5 Ω at 10 mA forward current and 100 MHz. Typical turn-on time (TL) is 25 ns at 10 mA forward current. Operating temperature ranges from -65 °C to +150 °C.
RF Diode Feature Summary
- Oxide-nitride passivation provides reliable operation and stable junction parameters with complete sealing.
- Glass frame surrounding the silicon mesa ensures superior mechanical strength and electrical performance.
- Lead-free, RoHS-compliant, and Green construction.
RF Diode Applications
- Broadband multithrow switches
- Phase shifters
- Limiters
- Attenuators
- Modulators
RF Diode Procurement Notes
Verify component authenticity by checking the datasheet revision number and manufacturer markings against official Skyworks documentation. Confirm compliance status through the Certificate of Conformance. Ensure handling procedures strictly follow beam-lead fragility guidelines to prevent mechanical damage during installation.
RF Diode Selection Notes
Select this component for microstrip or stripline circuits requiring high isolation from a series-mounted diode. Evaluate thermal management requirements as power dissipation derates linearly to zero at 175 °C. Verify substrate compatibility for thermocompression bonding, ensuring gold-plated surfaces meet thickness specifications for optimal metallurgical joints.
RF Diode Part Context
Skyworks Solutions manufactures the DSM8100-000 as part of its discrete semiconductor portfolio. This specific model utilizes a mesa beam-lead architecture, distinguishing it from standard planar packages. The design targets RF and microwave switching environments where minimal parasitic capacitance and rapid transition speeds are critical for system performance.
RF Diode Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation.
RF Diode FAQ
What is the recommended bonding tip temperature for the DSM8100-000?
A bonding tip temperature in the range of 350 °C to 450 °C is recommended for thermocompression bonding.
How should the DSM8100-000 be handled to prevent damage?
Due to fragility, use a vacuum pencil with an appropriate needle or a pointed wooden stick under a binocular microscope (20X to 30X magnification). Avoid undue mechanical strain and static discharge.
What is the maximum operating temperature for the DSM8100-000?
The maximum operating temperature is +150 °C.
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